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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

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Equipment name & NEMO ID Training Required & Chargessort descending Cleanliness Location Notes
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Plasma Therm Versaline LL ICP Dielectric Etcher Training Flexible SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Plasma Therm Versaline LL ICP Metal Etcher Training Flexible SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Plasmaetch PE-50
plasma-etch
Plasmaetch PE-50 Training Flexible SNF Exfab Paul G Allen 155 Mavericks

Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab

QSonica Q700 Sonicator
sonicator
Probe Sonicator Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Sinton Lifetime Tester
sinton-lifetime-tester
Sinton Lifetime Tester Training Flexible SNF Exfab Paul G Allen 151 Ocean
Solidscape Wax 3D Printer
3d-wax-printer
Solidscape 3D Wax Printer Training Flexible SNF Exfab Paul G Allen 151 Ocean
Thinky AR-100 Mixer
thinky-mixer
Thinky Mixer Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible SNF Exfab Paul G Allen 104 Stinson

Manual development of resist in beakers. SNF approved developers only. No solvents!

Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible SNF Exfab Paul G Allen 104 Stinson
Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot pots available. GaAs allowed in personal labware only

Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Wet Bench Flexcorr 4
wbflexcorr-4
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials using acids or bases. Hot plate, HF bath, and controlled temperature bath available. GaAs not allowed.

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials using acids or bases. Hot Plate available. GaAs not allowed.

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Wet Bench Flexible Solvents 2
wbflexsolv-2
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, hot plate

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, two ultrasonic baths.

Wet Bench Miscellaneous
wbmiscres
Wet Bench Miscellaneous Photoresist Training Flexible SNF Cleanroom Paul G Allen L107

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Wet Bench Resist Strip
wbresstrip-1
Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible SNF Cleanroom Paul G Allen L107

Wet Resist Removal: SRS-100 or PRS1000

EVG Wafer Bonder
evbond
Wafer Bonder EVG Training Flexible SNF Cleanroom Paul G Allen L107
Oven (White)
white-oven
White Oven Training Flexible SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
Oven (White)
white-oven
Flexible
0 °C - 200 °C
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Oven BlueM 200°C to 430°C
bluem
Flexible
0 °C - 430 °C
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Oxford Dielectric Etcher
oxford-rie
Flexible
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1
Oxford III-V etcher
Ox-35
Flexible
1
PDMS Hotplate
hotplate-1
Flexible
PDMS Spin Coater
spincoat-g3p8
Flexible
PDMS Workbench Flexible
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible ,
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Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
1
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Plasmaetch PE-50
plasma-etch
Flexible Multiple
Profilometer Alphastep 500
alphastep
Flexible ,
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1
Profilometer AlphaStep D-300
alphastep2
Flexible ,
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1
QSonica Q700 Sonicator
sonicator
Flexible
RTA AllWin 610
aw610_r
Flexible
21 °C - 1150 °C
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Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
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Four 4" wafers or two 6" wafers and one 8" wafer
Savannah ALD
savannah
Flexible
1.00 Å - 50.00 nm
24 °C - 250 °C
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Sinton Lifetime Tester
sinton-lifetime-tester
Flexible
Solidscape Wax 3D Printer
3d-wax-printer
Flexible

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