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6 inch wafer

Short Name:

6"

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
110°C Oven oven110	110°C Oven Training	All	SNF	SNF Cleanroom Paul G Allen L107	Bakes wafers with resist after the development, called post-bake.
90°C Oven oven90	90°C Oven Training	All	SNF	SNF Cleanroom Paul G Allen L107	Bakes wafers after resist coating.
AJA Evaporator aja-evap	AJA Evaporation training	Flexible	SNF	SNF Exfab Paul G Allen 155A Venice	For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
AJA2 Evaporator aja2-evap	AJA2 Evaporator	Semiclean	SNF	SNF Cleanroom Paul G Allen L107	For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance
Alphastep 500 Profilometer alphastep	Alphastep 500 Profilometer Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	500Å to 300µm
Aw610_l aw610_l	AllWin 610 RTA Training	Clean	SNF	SNF Cleanroom Paul G Allen L107
Aw610_r aw610_r	AllWin 610 RTA Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Blue M Oven bluem	Blue M Oven Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Convection in N2. Cure. Programmable.
Critical Point Dryer cpd	Critical Point Dryer Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	CO2 drying after release of micromachined devices
DISCO Wafer Saw DISCO wafersaw	DISCO wafersaw training	Flexible	SNF	SNF Exfab Paul G Allen 159 Capitola
Drytek 100 Plasma Etcher drytek2	Drytek 100 Plasma Etcher Training	All	SNF	SNF Cleanroom Paul G Allen L107	Batch processing tool; 6 stacked electrodes; no clamp; wafers and pieces can be loaded directly on the grounded electrode
EV Group Contact Aligner evalign	EV Group Contact Aligner Training	All	SNF	SNF Cleanroom Paul G Allen L107	1:1 Contact Aligner. Anodic Bond, backside align, including IR.
EVG 101 Spray Coater evgspraycoat	EVG 101 Spray Coater Training	All	SNF	SNF Cleanroom Paul G Allen L107	Spray coating of resists
Ex Fab Develop Wet Bench wbexfab_dev	WbExfab_Dev Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench wbexfab_solv	WbExfab_Solv Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Fiji 1 fiji1	Fiji 1 and 2 Training	Semiclean	SNF	SNF Cleanroom Paul G Allen L107
Fiji 2 fiji2	Fiji 1 and 2 Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Fiji 3 fiji3	Fiji 3 Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Restricted to non-conductive films only
Flexus 2320 Stress Tester stresstest	Flexus 2320 Stress Tester Training	All	SNF	SNF Cleanroom Paul G Allen L107
Headway Manual Resist Spinner headway2	Headway Manual Resist Spinner Training	All	SNF	SNF Cleanroom Paul G Allen L107	Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

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Equipment name & Badger ID	Technique	Cleaning Required	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Minimum Resolution	Exposure Wavelength	Mask Size	Max Exposure Area	Resist	Objective Separation	Process Temperature Range	Chemicals	Gases	Substrate Size	Substrate Type	Maximum Load
110°C Oven oven110	Optical Photolithography > Resist Bake > Oven Bake > Post Bake		All											110 ºC			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)
90°C Oven oven90	Optical Photolithography > Resist Bake > Oven Bake > Prebake		All											90 ºC			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
AJA Evaporator aja-evap	Deposition > Physical Vapor Deposition (PVD) > Evaporation		Flexible			0 - 300 nm	Ag Al Au Co Cr Cu Fe Ge Hf Ni Ni_xO_y Pd Pt SiO₂ Ti Titania										Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various)	4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator aja2-evap	Deposition > Physical Vapor Deposition (PVD) > Evaporation		Semiclean			0 - 300 nm	Ag Al Co Cr Ge Hf Nb Pd Pt Si Ta Ti V W Zr Moly										Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (Ge) , (Various)	4"x3 or 6"x1 wafers or pieces
Alphastep 500 Profilometer alphastep	Characterization > Surface Analysis > Profilometer > Step Profile		Flexible														Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
Aw610_l aw610_l	Annealing & Oxidation > Rapid Thermal Annealing	Pre-Diffusion Clean	Clean											21 °C - 1150 °C		4% H₂ in N₂ Ar N₂ NH₃ O₂	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2)	1 wafer
Aw610_r aw610_r	Annealing & Oxidation > Rapid Thermal Annealing		Flexible											21 °C - 1150 °C		4% H₂ in N₂ Ar N₂ NH₃ O₂	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2)
Blue M Oven bluem	Optical Photolithography > Resist Bake > Oven Bake		Flexible											0 °C - 430 °C			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs) , (Various)
Critical Point Dryer cpd	Drying > CO2 Drying		Flexible												CO₂		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)
DISCO Wafer Saw DISCO wafersaw	Machining > Wafer Saw		Flexible														Pieces 2" 3" 4" 6" 8"	(Si) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1x4", 1x6" or 1x8" wafer, or pieces
Drytek 100 Plasma Etcher drytek2	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Plasma Mode Etching		All	Si SiN Poly Silicon Resist	C SiO₂ PI											CF₄ CHClF₂ O₂ SF₆	Pieces 2" 3" 4" 6"		6
EV Group Contact Aligner evalign	Optical Photolithography > Exposure > Contact Aligner		All						350 - 450 nm	5 inch, 7 inch	5 inch mask = 4 inch, 7 inch mask = 6 inch						Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	one piece or wafer
EVG 101 Spray Coater evgspraycoat	Optical Photolithography > Resist coat > Resist Spray Coat (manual)		All									Resists					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	1
Ex Fab Develop Wet Bench wbexfab_dev	Optical Photolithography > Resist Develop		Flexible														Pieces 2" 3" 4" 6" 8" 12" Other
Ex Fab Solvent Wet Bench wbexfab_solv	Patterning > Metal Lift-off Cleaning > Solvent Cleaning		Flexible												Solvents		Pieces 2" 3" 4" 6" 8" Other
Fiji 1 fiji1	Deposition > Atomic Layer Deposition (ALD) > Plasma Enhanced (PE) ALD		Semiclean			1 Å - 50 nm	Metal oxides HfN Pt Ru SiO₂ Ta₂O₅ TaN TiN Various Dielectrics Alumina Hafnia Titania Zirconia							24 °C - 350 °C		Ar H₂ N₂ NH₃ O₂	Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2)
Fiji 2 fiji2	Deposition > Atomic Layer Deposition (ALD) > Plasma Enhanced (PE) ALD		Flexible			1 Å - 50 nm	Metal oxides Ga₂O₃ HfN In₂O₃ Ni_xO_y Pt Ru SiN SiO₂ SnO₂ SrO Ta₂O₅ TiN Various Dielectrics Alumina Hafnia ITO Moly Oxide Titania Zirconia							24 °C - 350 °C		Ar H₂ N₂ O₂	Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (Various) , (Various) , (LiNb) , (Various)
Fiji 3 fiji3	Deposition > Atomic Layer Deposition (ALD) > Plasma Enhanced (PE) ALD		Flexible			1 Å - 50 nm	SiO₂ Various Dielectrics Alumina Hafnia Titania							24 °C - 350 °C		Ar H₂ N₂ NH₃ O₂	Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (III-V)
Flexus 2320 Stress Tester stresstest	Characterization > Film Stress Measurement		All														3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)	1
Headway Manual Resist Spinner headway2	Optical Photolithography > Resist coat > Resist Coat (manual)		All									AZ5214IR Shipley 3612 resist SPR 955 CM-.7 resist SPR220-3 resist SPR220-7 (C₅O₂H₈)_n					Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	one piece or wafer

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