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4 inch wafer

Short Name: 
4"

The following is a list of equipment where 4 inch round substrates are allowed.

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Equipment name & NEMO ID Training Required & Chargessort descending Cleanliness Location Notes
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible SNF Exfab Paul G Allen 155 Mavericks
Keyence Digital Microscope VHX-6000
keyence
Microscope Keyence Training All SNF Exfab Paul G Allen 104 Stinson
Nanospec 3
nanospec3
Nanospec 3 Training All SNF Cleanroom Paul G Allen L107
Headway 3 Manual Resist Spinner
headway3
Resist Coat (manual) Headway 3 Training All SNF Exfab Paul G Allen 104 Stinson
Wet Bench Decontamination
wbdecon
Wet Bench Decontamination Training Clean SNF Cleanroom Paul G Allen L107

KOH or wafersaw or post-cmp decontamination

LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All SNF Exfab Paul G Allen 151 Ocean
Technics Asher
technics
Technics Asher Training Flexible SNF Cleanroom Paul G Allen L107
Samco PC300 Plasma Etch System
samco
Samco Training Flexible SNF Cleanroom Paul G Allen L107
Lesker Sputter
lesker-sputter
Sputter Lesker 1&2 Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lesker2 Sputter
lesker2-sputter
Sputter Lesker 1&2 Training Semiclean SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Wet Bench Clean 2
wbclean-2
Wet Bench Clean1and2 Training Clean SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Wet Bench Clean 1
wbclean-1
Wet Bench Clean1and2 Training Clean SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

SEM -Zeiss Merlin
sem-merlin
SEM-Merlin Training All SNF Exfab Paul G Allen 104 Stinson
Profilometer AlphaStep D-300
alphastep2
AlphaStep2 Training Flexible SNF Exfab Paul G Allen 104 Stinson

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Equipment name & NEMO ID Technique Cleanliness Primary Materials Etched Other Materials Etched Developer Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Wet Bench CMOS Metal
wbclean3
Semiclean
,
,
25 wafers
Wet Bench Decontamination
wbdecon
Clean
,
,
Wet Bench Flexcorr 1
wbflexcorr-1
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 2
wbflexcorr-2
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 3
wbflexcorr-3
Flexible ,
,
,
,
,
,
,
,
,
Wet Bench Flexcorr 4
wbflexcorr-4
Flexible
Wet Bench Flexible Solvents
wbflexsolv
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 1
wbflexsolv-1
Flexible ,
,
,
,
,
,
,
,
,
,
Wet Bench Flexible Solvents 2
wbflexsolv-2
Flexible ,
,
,
,
,
,
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,
,
Wet Bench Miscellaneous
wbmiscres
Flexible ,
,
,
,
,
,
,
,
Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
,
,
,
,
,
,
25 4 inch wafers
Wet Bench Solvent Lithography
lithosolv
Flexible ,
,
,
,
,
,
,
,
Woollam
woollam
All ,
,
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1
Xactix Xenon Difluoride Etcher
xactix
All ,
,
,
,
,
,
,
,
,
1

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