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Stanford Nanofabrication Facility
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Poly Si
Preferred Short Name:
Poly Silicon
Chemical Formula:
Si
Equipment Tabs
Annealing & Oxidation Equipment
Equipment name or Badger ID
Partial words okay.
Deposition Equipment
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
Epi2
epi2
Clean
SNF Cleanroom Paul G Allen L107
50 Å
-
3 μm
Ge
Si
Si
SiGe
Deposition Equipment
Equipment name or Badger ID
Partial words okay.
Deposition Equipment
Equipment name & Badger ID
Cleanliness
Location
Material Thickness Range
Approved Materials supplied by Lab
Epi2
epi2
Clean
SNF Cleanroom Paul G Allen L107
50 Å
-
3 μm
Ge
Si
Si
SiGe
ThermcoPoly1
thermcopoly1
Clean
SNF Cleanroom Paul G Allen L107
100 Å
-
3 μm
Ge
Si
Si
SiGe
ThermcoPoly2
thermcopoly2
Flexible
SNF Cleanroom Paul G Allen L107
100 Å
-
3 μm
Ge
Si
Si
SiGe
Etching Equipment
Equipment name or Badger ID
Partial words okay.
Etch Equipment
Equipment name & Badger ID
Cleanliness
Location
Primary Materials Etched
Other Materials Etched
AMAT P5000 Etcher
p5000etch
Clean
Clean (Ge)
Semiclean
SNF Cleanroom Paul G Allen L107
Si based materials
Si
SiGe
SiN
SiO
2
SiON
Poly Silicon
C
C
C
dimethylpolysiloxane
poly(p-xylylene)
SiC
Ti
Various C-based
W
WSi
2
PI
Resist
Ti Tungsten
Lam Research TCP 9400 Poly Etcher
lampoly
Clean
Semiclean
SNF Cleanroom Paul G Allen L107
Si
Poly Silicon
Ge
SiGe
Samco PC300 Plasma Etch System
samco
Flexible
SNF Cleanroom Paul G Allen L107
Resist
Si based materials
dimethylpolysiloxane
Si
SiN
SiO
2
SiON
Various polymers
PI
Poly Silicon
Projects
Final report on Low Stress Poly-silicon trials
-- (Report)
Proposal: Low Stress PolySi film development
-- (Report)
Low Stress Poly-Si Film Development