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Sapphire

Chemical Formula: 
Al2O3
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Equipment name & Badger IDsort ascending Training Required & Charges Cleanliness Lab Organization Location Notes
Fiji 2
fiji2
Fiji 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
EVG 101 Spray Coater
evgspraycoat
EVG 101 Spray Coater Training All
SNF
SNF Cleanroom Paul G Allen L107

Spray coating of resists

EV Group Wafer Bonder
evbond
EV Group Wafer Bonder Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
EV Group Contact Aligner
evalign
EV Group Contact Aligner Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
Critical Point Dryer
cpd
Critical Point Dryer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

Blue M Oven
bluem
Blue M Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

ASML PAS 5500/60 i-line Stepper
asml
ASML PAS 5500/60 i-line Stepper Training All
SNF
SNF Cleanroom Paul G Allen L107

5:1 reducing stepper

Alphastep 500 Profilometer
alphastep
Alphastep 500 Profilometer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

500Å to 300µm

AJA2 Evaporator
aja2-evap
AJA2 Evaporator Semiclean
SNF
SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

AJA Evaporator
aja-evap
AJA Evaporation training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Aix-ccs
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD)
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

90°C Oven
oven90
90°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

110°C Oven
oven110
110°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

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Equipment name & Badger IDsort ascending Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Fiji 2
fiji2
Flexible
1 Å - 50 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
EVG 101 Spray Coater
evgspraycoat
All
,
,
,
,
1
EV Group Wafer Bonder
evbond
Flexible
,
,
,
,
,
EV Group Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch
,
,
,
,
one piece or wafer
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
Critical Point Dryer
cpd
Flexible
,
,
,
,
,
,
,
,
,
Blue M Oven
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
Alphastep 500 Profilometer
alphastep
Flexible
,
,
,
,
,
,
,
,
1
AJA2 Evaporator
aja2-evap
Semiclean
0 - 300 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Aix-ccs
aix-ccs
Special: See Notes Clean (MOCVD)
0 - 5 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
90°C Oven
oven90
All
90 ºC
,
,
,
,
,
,
,
,
110°C Oven
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,

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