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Sapphire

Chemical Formula: 
Al2O3
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Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
Matrix Plasma Resist Strip
matrix
Matrix Plasma Resist Strip Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.

micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training All
SNF
SNF Exfab Paul G Allen 151 Ocean
Nanospec 210XP
nanospec2
Nanospec Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Å

Oxford Dielectric Etcher
oxford-rie
Oxford Dielectric Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All
SNF
SNF Cleanroom Paul G Allen L107

3 Probe Heads for different Cleanliness

SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All
SNF
SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic Resist spinning and bake

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

Tencor P2 Profilometer
p2
Tencor P2 Profilometer Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Step height measurement range 500 Å to 80 µm

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot Plate available. GaAs not allowed.

Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. 3 hot pots available. GaAs allowed in personal labware only

Wet Bench Flexible Solvents 2
wbflexsolv-2
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, hot plate

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, two ultrasonic baths.

Wet Bench Miscellaneous
wbmiscres
Wet Bench Miscellaneous Photoresist Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Wet Bench Resist Strip
wbresstrip-1
Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible
SNF
SNF Cleanroom Paul G Allen L107

Wet Resist Removal: SRS-100 or PRS1000

Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All
SNF
SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

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Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Developer Objective Separation Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
Karl Suss MA-6 Contact Aligner 1
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch
,
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,
,
,
Karl Suss MA-6 Contact Aligner 2
karlsuss2
All
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch
,
,
,
,
,
,
,
,
,
Keyence Digital Microscope VHX-6000
keyence
All
,
,
,
,
,
,
,
,
Lakeshore Hall Measurement System
LakeshoreHall
All
100 μm - 1000 μm
-258 °C - 1000 °C
8 in wafer

Sensor Transducer Size is 14 mm diameter 

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,
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,
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,
,
1 piece
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All
8 in wafer

Sensor Transducer Size is 14 mm diameter 

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,
,
1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible
,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1 μm
°C - 800 °C
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,
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,
,
,
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,
one 4 inch wafer, one 6 inch wafer
Lithography Solvent Bench
lithosolv
Flexible
,
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,
Matrix Plasma Resist Strip
matrix
Flexible
,
,
,
,
25
micromanipulator6000 IV-CV probe station
micromanipulator6000
All
,
,
,
,
,
,
,
,
,
,
,
1x4" wafer
Nanospec 210XP
nanospec2
All
,
,
,
,
,
,
,
,
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible
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,
Prometrix Resistivity Mapping System
prometrix
All
,
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,
,
,
,
1
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
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,
Four 4" wafers or two 6" wafers and one 8" wafer
Savannah
savannah
Flexible
1 Å - 50 nm
24 °C - 250 °C
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Sensofar S-neox
s-neox
All
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1
SPTS uetch vapor etch
uetch
All
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1
SVG Develop Track 1
svgdev
All
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25 4 inch wafers
SVG Develop Track 2
svgdev2
All
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25 4 inch wafers

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