Equipment name & Badger ID | Technique | Cleaning Required | Cleanliness | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Max Exposure Area | Resist | Objective Separation | Process Temperature Range | Chemicals | Gases | Substrate Size | Substrate Type | Maximum Load |
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110°C Oven oven110 |
All |
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110 ºC
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90°C Oven oven90 |
All |
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90 ºC
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Aix-ccs aix-ccs |
Special: See Notes | Clean (MOCVD) |
0 -
5 μm
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400 °C - 1300 °C
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4"x1, 2"X3, pieces | |||||||||
AJA Evaporator aja-evap |
Flexible |
0 -
300 nm
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4"x3 or 6"x1 wafers or pieces | ||||||||||
AJA2 Evaporator aja2-evap |
Semiclean |
0 -
300 nm
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4"x3 or 6"x1 wafers or pieces | ||||||||||
Alphastep 500 Profilometer alphastep |
Flexible |
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1 | ||||||||||
ASML PAS 5500/60 i-line Stepper asml |
All |
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365 nm | 5 inch |
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Blue M Oven bluem |
Flexible |
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0 °C - 430 °C
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Critical Point Dryer cpd |
Flexible |
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DISCO Wafer Saw DISCO wafersaw |
Flexible |
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1x4", 1x6" or 1x8" wafer, or pieces | ||||||||||
EV Group Contact Aligner evalign |
All |
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350 - 450 nm | 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch |
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one piece or wafer | |||||||
EV Group Wafer Bonder evbond |
Flexible |
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EVG 101 Spray Coater evgspraycoat |
All |
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1 | ||||||||||
Fiji 2 fiji2 |
Flexible |
1 Å -
50 nm
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24 °C - 350 °C
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Finetech Lambda flipchipbonder |
Flexible |
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°C - 400 °C
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1 | ||||||||||
Flexus 2320 Stress Tester stresstest |
All |
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1 | ||||||||||
Headway Manual Resist Spinner headway2 |
All |
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one piece or wafer | ||||||||||
Heidelberg MLA 150 heidelberg |
All |
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405 nm |
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1 | |||||||||
Heidelberg MLA 150 - 2 heidelberg2 |
All |
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375 nm |
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1 | |||||||||
HMDS Vapor Prime Oven, YES yes |
All |
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150 ºC
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