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Sapphire

Chemical Formula: 
Al2O3
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Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
Fiji 2
fiji2
Fiji 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Savannah
savannah
Savannah Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Aix-ccs
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD)
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

AJA2 Evaporator
aja2-evap
AJA2 Evaporator Semiclean
SNF
SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

90°C Oven
oven90
90°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

110°C Oven
oven110
110°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

Alphastep 500 Profilometer
alphastep
Alphastep 500 Profilometer Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

ASML PAS 5500/60 i-line Stepper
asml
ASML PAS 5500/60 i-line Stepper Training All
SNF
SNF Cleanroom Paul G Allen L107

5:1 reducing stepper

Blue M Oven
bluem
Blue M Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

Critical Point Dryer
cpd
Critical Point Dryer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
EV Group Contact Aligner
evalign
EV Group Contact Aligner Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

EVG 101 Spray Coater
evgspraycoat
EVG 101 Spray Coater Training All
SNF
SNF Cleanroom Paul G Allen L107

Spray coating of resists

Finetech Lambda
flipchipbonder
Flip Chip Bonder Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
Headway Manual Resist Spinner
headway2
Headway Manual Resist Spinner Training All
SNF
SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Woollam
woollam
Woollam Training All
SNF
SNF Cleanroom Paul G Allen L107
Karl Suss MA-6 Contact Aligner 2
karlsuss2
Karl Suss MA-6 Contact Aligner 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align.

Karl Suss MA-6 Contact Aligner 1
karlsuss
Karl Suss MA-6 Contact Aligner 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align, including IR.

Lesker2 Sputter
lesker2-sputter
Lesker2 Sputter Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lithography Solvent Bench
lithosolv
Lithography Solvent Bench Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Pages

Equipment name & Badger ID Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
110°C Oven
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
90°C Oven
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Aix-ccs
aix-ccs
Special: See Notes Clean (MOCVD)
0 - 5 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Semiclean
0 - 300 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Alphastep 500 Profilometer
alphastep
Flexible
,
,
,
,
,
,
,
,
1
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
Blue M Oven
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Critical Point Dryer
cpd
Flexible
,
,
,
,
,
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
EV Group Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch
,
,
,
,
one piece or wafer
EV Group Wafer Bonder
evbond
Flexible
,
,
,
,
,
EVG 101 Spray Coater
evgspraycoat
All
,
,
,
,
1
Fiji 2
fiji2
Flexible
1 Å - 50 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Finetech Lambda
flipchipbonder
Flexible
°C - 400 °C
,
,
,
,
,
1
Flexus 2320 Stress Tester
stresstest
All
,
,
,
,
,
,
,
,
1
Headway Manual Resist Spinner
headway2
All
,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,

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