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6 inch wafer

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Equipment name & Badger IDsort ascending Training Required & Charges Cleanliness Location Notes
HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All SNF Cleanroom Paul G Allen L107

Direct Write

Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

Headway Manual Resist Spinner
headway2
Resist Coat (manual) Headway Manual Training All SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Fiji 3 ALD
fiji3
ALD Fiji 3 Training Flexible SNF Cleanroom Paul G Allen L107

Restricted to non-conductive films only

Fiji 2 ALD
fiji2
ALD Fiji 1 and 2 Training Flexible SNF Cleanroom Paul G Allen L107
Fiji 1 ALD
fiji1
ALD Fiji 1 and 2 Training Semiclean SNF Cleanroom Paul G Allen L107
Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible SNF Exfab Paul G Allen 104 Stinson
Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible SNF Exfab Paul G Allen 104 Stinson

Manual development of resist in beakers. SNF approved developers only. No solvents!

EVG Contact Aligner
evalign
Contact Aligner EVG Training All SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

EVG 101 Spray Coater
evgspraycoat
Spray Coater EVG 101 Training All SNF Cleanroom Paul G Allen L107

Spray coating of resists

DISCO Wafer Saw
DISCO wafersaw
Wafersaw DISCO training Flexible SNF Exfab Paul G Allen 159 Capitola
AJA2 Evaporator
aja2-evap
Evaporator AJA2 Semiclean SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

AJA Evaporator
aja-evap
Evaporator AJA training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

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Equipment name & Badger IDsort ascending Technique Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Developer Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150
heidelberg
All
405 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
Headway Manual Resist Spinner
headway2
All ,
,
,
,
,
,
,
,
,
one piece or wafer
Flexus 2320 Stress Tester
stresstest
All ,
,
,
,
,
,
,
,
1
Fiji 3 ALD
fiji3
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Fiji 2 ALD
fiji2
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Fiji 1 ALD
fiji1
Semiclean
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Ex Fab Solvent Wet Bench
wbexfab_solv
Flexible
Ex Fab Develop Wet Bench
wbexfab_dev
Flexible
EVG Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch ,
,
,
,
one piece or wafer
EVG 101 Spray Coater
evgspraycoat
All ,
,
,
,
1
DISCO Wafer Saw
DISCO wafersaw
Flexible ,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
AJA2 Evaporator
aja2-evap
Semiclean
0.00 - 300.00 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA Evaporator
aja-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces

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