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6 inch wafer

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6"
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Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
Wet Bench Clean 1
wbclean-1
Wet Bench Clean 1 and 2 Training Clean
SNF
SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Wet Bench Clean 2
wbclean-2
Wet Bench Clean 1 and 2 Training Clean
SNF
SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Wet Bench Clean_res-piranha
wbclean_res-piranha
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist will be removed

Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist should have been removed

Wet Bench Clean_res-hf
wbclean_res-hf
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist as mask allowed

Wet Bench CMOS Metal (wbclean3)
wbclean3
Wet Bench CMOS Metal (wbclean3) Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Al, Ti, or W wet etching or oxide etching

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot Plate available. GaAs not allowed.

Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. 3 hot pots available. GaAs allowed in personal labware only

Wet Bench Flexcorr 4
wbflexcorr-4
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. CTB. Labware for "clean" KOH or TMAH etching available. GaAs not allowed.

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, two ultrasonic baths.

Wet Bench Flexible Solvents 2
wbflexsolv-2
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, hot plate

Wet Bench Miscellaneous
wbmiscres
Wet Bench Miscellaneous Photoresist Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All
SNF
SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

ThermcoNitride
thermconitride1
Thermco Nitride Deposition Furnace Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Stociometric and low stress (~150mPa) programs available

ThermcoPoly1
thermcopoly1
Thermco Poly Deposition Furnace Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Standard polysilicon deposition at 620C. P and N doping available. Amorphous Si programs available.

ThermcoPoly2
thermcopoly2
Thermco Poly Deposition Furnace Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Standard polysilicon deposition at 620C. P and N doping available.

Pages

Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Objective Separation Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Plasmaetch PE-50
plasma-etch
Flexible
Multiple
Prometrix Resistivity Mapping System
prometrix
All
,
,
,
,
,
,
,
,
1
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer
Savannah
savannah
Flexible
1 Å - 50 nm
24 °C - 250 °C
,
,
,
,
,
,
,
,
,
,
,
,
Sensofar S-neox
s-neox
All
,
,
,
,
,
,
,
,
1
Sinton Lifetime Tester
sinton-lifetime-tester
Flexible
SPTS uetch vapor etch
uetch
All
,
,
,
,
,
,
,
,
,
1
STS Plasma Enhanced CVD
sts
Flexible
100 Å - 5 μm
350 ºC
Four 4 inch or one 6 inch or one 8 inch
Technics Asher
technics
Flexible
,
,
Four 4" wafers to pieces, one 6" or 8" wafer
Tencor P2 Profilometer
p2
Clean, Semiclean
,
,
,
,
,
,
,
,
1
Teos2
teos2
Pre-Diffusion Clean Clean
50 Å - 5 μm
450 °C - 680 °C
,
,
45
Thermco1
thermco1
Pre-Diffusion Clean Clean
25 Å - 2 μm
700 °C - 1100 °C
,
,
50
Thermco3
thermco 3
Pre-Diffusion Clean Clean
25 Å - 2 μm
700 °C - 1100 °C
50
Thermco4
thermco4
Flexible
25 Å - 2 μm
700 °C - 1100 °C
50
ThermcoLTO
thermcoLTO
Flexible
100 Å - 3 μm
300 °C - 450 °C
,
,
26
ThermcoNitride
thermconitride1
Pre-Diffusion Clean Clean
100 Å - 2 μm
785 °C - 850 °C
44
ThermcoPoly1
thermcopoly1
Pre-Diffusion Clean Clean
100 Å - 3 μm
525 °C - 650 °C
,
,
44
ThermcoPoly2
thermcopoly2
Pre-Diffusion Clean Flexible
100 Å - 3 μm
525 °C - 650 °C
44

Pages