Equipment name & Badger ID |
Training Required & Charges![]() |
Cleanliness | Location | Notes |
---|---|---|---|---|
Laurell Manual Resist Spinner laurell-R |
Laurell Manual Resist Spinner Training | All | SNF Cleanroom Paul G Allen L107 |
SU-8, LOL, Ebeam resists allowed. No Acetone allowed. |
Lesker2 Sputter lesker2-sputter |
Lesker2 Sputter Training | Semiclean | SNF Cleanroom Paul G Allen L107 |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Lithography Solvent Bench lithosolv |
Lithography Solvent Bench Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning. |
MRC Reactive Ion Etcher mrc |
MRC Reactive Ion Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode |
Nanospec 210XP nanospec2 |
Nanospec Training | All | SNF Exfab Paul G Allen 104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã |
Optomec Printer optomec-printer |
Optomec Printer Training | Flexible | SNF Exfab Paul G Allen 155A Venice | |
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Plasma Therm Versaline LL ICP Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Plasmaetch PE-50 plasma-etch |
Plasmaetch PE-50 Training | Flexible | SNF Exfab Paul G Allen 155 Mavericks |
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab |
Prometrix Resistivity Mapping System prometrix |
Prometrix Training | All | SNF Cleanroom Paul G Allen L107 |
3 Probe Heads for different cleanliness groups. |
Sinton Lifetime Tester sinton-lifetime-tester |
Sinton Lifetime Tester Training | Flexible | SNF Exfab Paul G Allen 151 Ocean | |
SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training | All | SNF Cleanroom Paul G Allen L107 |
Pieces need a carrier wafer; Isotropic Etching |
Tencor P2 Profilometer p2 |
Tencor P2 Profilometer Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
Step height measurement range 500 Å to 80 µm |
Thermco3 Oxidation Furnace thermco 3 |
Thermco Oxidation Furnaces Training | Clean | SNF Cleanroom Paul G Allen L107 |
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
Thermco4 Oxidation Furnace thermco4 |
Thermco Oxidation Furnaces Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
Thermco1 Oxidation Furnace thermco1 |
Thermco Oxidation Furnaces Training | Clean | SNF Cleanroom Paul G Allen L107 |
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
Ex Fab Develop Wet Bench wbexfab_dev |
WbExfab_Dev Training | Flexible | SNF Exfab Paul G Allen 104 Stinson |
Manual development of resist in beakers. SNF approved developers only. No solvents! |
Ex Fab Solvent Wet Bench wbexfab_solv |
WbExfab_Solv Training | Flexible | SNF Exfab Paul G Allen 104 Stinson | |
Wet Bench Clean 2 wbclean-2 |
Wet Bench Clean 1 and 2 Training | Clean | SNF Cleanroom Paul G Allen L107 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha |
Equipment name & Badger ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Materials User Supplied | Minimum Resolution | Exposure Wavelength | Mask Size | Max Exposure Area | Resist | Process Temperature Range | Chemicals | Gases | Sample Size Limits | Resolution Notes | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Karl Suss MA-6 Contact Aligner 1 karlsuss |
All |
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365 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch |
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Karl Suss MA-6 Contact Aligner 2 karlsuss2 |
All |
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365 nm or 405 nm | 4 inch, 5 inch, 7 inch | 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch |
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Keyence Digital Microscope VHX-6000 keyence |
All |
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Laurell Manual Resist Spinner laurell-R |
All | |||||||||||||||||||
LEI1500 Contactless Sheet Resistance Mapping eddycurrent |
All | 8 in wafer |
Sensor Transducer Size is 14 mm diameter |
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1 wafer(2" to 8") | |||||||||||||||
Lesker Sputter lesker-sputter |
Flexible |
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1 4 inch wafer, 1 6 inch wafer | |||||||||||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
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one 4 inch wafer, one 6 inch wafer | |||||||||||||||
Lithography Solvent Bench lithosolv |
Flexible |
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MRC Reactive Ion Etcher mrc |
Flexible | 1 | ||||||||||||||||||
MVD mvd |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 150 °C
|
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Nanospec 210XP nanospec2 |
All |
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Nanospec 3 nanospec3 |
All | |||||||||||||||||||
Optomec Printer optomec-printer |
Flexible | |||||||||||||||||||
Oven 110°C post-bake oven110 |
All |
110 ºC
|
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Oven 90°C prebake oven90 |
All |
90 ºC
|
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Oven BlueM 200°C to 430°C bluem |
Flexible |
0 °C - 430 °C
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PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
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Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Flexible | 1 | ||||||||||||||||||
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Flexible | 1 | ||||||||||||||||||
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Flexible | 1 |