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4 inch wafer

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4"
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Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
Wet Bench Clean 2
wbclean-2
Wet Bench Clean 1 and 2 Training Clean
SNF
SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha

Wet Bench Clean 1
wbclean-1
Wet Bench Clean 1 and 2 Training Clean
SNF
SNF Cleanroom Paul G Allen L107

No resist allowed. Resist should have been removed at the wbclean_res-piranha.

Wet Bench Clean_res- hotphos
wbclean_res-hotphos
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist should have been removed

Wet Bench Clean_res-hf
wbclean_res-hf
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist as mask allowed

Wet Bench Clean_res-piranha
wbclean_res-piranha
Wet Bench Clean Piranha/HF/Phosphoric Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Resist will be removed

Wet Bench CMOS Metal (wbclean3)
wbclean3
Wet Bench CMOS Metal (wbclean3) Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Al, Ti, or W wet etching or oxide etching

Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. 3 hot pots available. GaAs allowed in personal labware only

Wet Bench Flexcorr 4
wbflexcorr-4
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. CTB. Labware for "clean" KOH or TMAH etching available. GaAs not allowed.

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot Plate available. GaAs not allowed.

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, two ultrasonic baths.

Wet Bench Flexible Solvents 2
wbflexsolv-2
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, hot plate

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Wet Bench Germanium
wbgen2
Wet Bench Germanium Training Clean (Ge)
SNF
SNF Cleanroom Paul G Allen L107

Clean Germanium wafers only: Pre-Diffusion Clean

Wet Bench Miscellaneous
wbmiscres
Wet Bench Miscellaneous Photoresist Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Wet Bench Resist Strip
wbresstrip-1
Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible
SNF
SNF Cleanroom Paul G Allen L107

Wet Resist Removal: SRS-100 or PRS1000

Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All
SNF
SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

HMDS Vapor Prime Oven, YES
yes
YES Prime Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Two programs: Singe and HMDS prime or Singe only. No Resist allowed!

Pages

Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Resist Developer Objective Separation Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
PlasmaTherm Versaline HDP CVD System
hdpcvd
Special: See Notes All
500 Å - 4 μm
50 °C - 150 °C
1
Prometrix Resistivity Mapping System
prometrix
All
,
,
,
,
,
,
,
,
1
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer
Savannah
savannah
Flexible
1 Å - 50 nm
24 °C - 250 °C
,
,
,
,
,
,
,
,
,
,
,
,
Sensofar S-neox
s-neox
All
,
,
,
,
,
,
,
,
1
Sinton Lifetime Tester
sinton-lifetime-tester
Flexible
SPTS uetch vapor etch
uetch
All
,
,
,
,
,
,
,
,
,
1
STS Deep RIE Etcher
stsetch
Clean, Semiclean
1
STS Plasma Enhanced CVD
sts
Flexible
100 Å - 5 μm
350 ºC
Four 4 inch or one 6 inch or one 8 inch
SVG Develop Track 1
svgdev
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Develop Track 2
svgdev2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 1
svgcoat
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 2
svgcoat2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
Technics Asher
technics
Flexible
,
,
Four 4" wafers to pieces, one 6" or 8" wafer
Tencor P2 Profilometer
p2
Clean, Semiclean
,
,
,
,
,
,
,
,
1
Teos2
teos2
Pre-Diffusion Clean Clean
50 Å - 5 μm
450 °C - 680 °C
,
,
45
Thermco1
thermco1
Pre-Diffusion Clean Clean
25 Å - 2 μm
700 °C - 1100 °C
,
,
50
Thermco3
thermco 3
Pre-Diffusion Clean Clean
25 Å - 2 μm
700 °C - 1100 °C
50
Thermco4
thermco4
Flexible
25 Å - 2 μm
700 °C - 1100 °C
50
ThermcoLTO
thermcoLTO
Flexible
100 Å - 3 μm
300 °C - 450 °C
,
,
26

Pages