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4 inch wafer

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4"
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Equipment name & Badger ID Training Required & Charges Cleanliness Lab Organization Location Notes
Oxford III-V etcher
Ox-35
Oxford III-V etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.

Oxford PlasmaPro 80 - Reactive Ion etcher
RIE: Oxford PlasmaPro 80 (at SNSF)
Oxford PlasmaPro 80 - Reactive Ion etcher Training

No carrier wafer needed; multiple pieces can be processed together Location: SNSF; Spilker Building - Nanopatterning cleanroom

PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching

Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Plasma Therm Versaline LL ICP Dielectric Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Plasma Therm Versaline LL ICP Metal Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Plasmaetch PE-50
plasma-etch
Plasmaetch PE-50 Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks

Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab

PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All
SNF
SNF Cleanroom Paul G Allen L107

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

PlasmaTherm Versaline HDP CVD System
hdpcvd
PlasmaTherm Versaline HDP CVD System Training All
SNF
SNF Cleanroom Paul G Allen L107

To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) .  Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All
SNF
SNF Cleanroom Paul G Allen L107

3 Probe Heads for different Cleanliness

Samco PC300 Plasma Etch System
samco
Samco Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Savannah
savannah
Savannah Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Sensofar S-neox
s-neox
Sensofar S-neox Training All
SNF
SNF Cleanroom Paul G Allen L107

non contact 3D optical profiling

Sinton Lifetime Tester
sinton-lifetime-tester
Sinton Lifetime Tester Training Flexible
SNF
SNF Exfab Paul G Allen 151 Ocean
SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All
SNF
SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

STS Deep RIE Etcher
stsetch
STS Deep RIE Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching

STS Plasma Enhanced CVD
sts
STS Plasma Enhanced CVD Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic Resist spinning and bake

Pages

Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Resist Developer Objective Separation Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
Oxford III-V etcher
Ox-35
Flexible
1
Oxford PlasmaPro 80 - Reactive Ion etcher
RIE: Oxford PlasmaPro 80 (at SNSF)
1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible
,
,
,
,
,
,
,
,
,
,
,
,
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
1
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Plasmaetch PE-50
plasma-etch
Flexible
Multiple
PlasmaTherm Shuttlelock PECVD System
ccp-dep
Special: See Notes All
100 Å - 4 μm
100 °C - 350 °C
4
PlasmaTherm Versaline HDP CVD System
hdpcvd
Special: See Notes All
500 Å - 4 μm
50 °C - 150 °C
1
Prometrix Resistivity Mapping System
prometrix
All
,
,
,
,
,
,
,
,
1
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer
Savannah
savannah
Flexible
1 Å - 50 nm
24 °C - 250 °C
,
,
,
,
,
,
,
,
,
,
,
,
Sensofar S-neox
s-neox
All
,
,
,
,
,
,
,
,
1
Sinton Lifetime Tester
sinton-lifetime-tester
Flexible
SPTS uetch vapor etch
uetch
All
,
,
,
,
,
,
,
,
,
1
STS Deep RIE Etcher
stsetch
Clean, Semiclean
1
STS Plasma Enhanced CVD
sts
Flexible
100 Å - 5 μm
350 ºC
Four 4 inch or one 6 inch or one 8 inch
SVG Develop Track 1
svgdev
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Develop Track 2
svgdev2
All
,
,
,
,
,
,
,
,
25 4 inch wafers
SVG Resist Coat Track 1
svgcoat
All
,
,
,
,
,
,
,
,
25 4 inch wafers

Pages