Equipment name & Badger ID |
Training Required & Charges![]() |
Cleanliness | Location | Notes |
---|---|---|---|---|
Oxford III-V etcher Ox-35 |
Oxford III-V etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only. |
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Plasma Therm Versaline LL ICP Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Plasmaetch PE-50 plasma-etch |
Plasmaetch PE-50 Training | Flexible | SNF Exfab Paul G Allen 155 Mavericks |
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab |
PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training | All | SNF Cleanroom Paul G Allen L107 |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
Prometrix Resistivity Mapping System prometrix |
Prometrix Training | All | SNF Cleanroom Paul G Allen L107 |
3 Probe Heads for different Cleanliness |
Sinton Lifetime Tester sinton-lifetime-tester |
Sinton Lifetime Tester Training | Flexible | SNF Exfab Paul G Allen 151 Ocean | |
SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training | All | SNF Cleanroom Paul G Allen L107 |
Pieces need a carrier wafer; Isotropic Etching |
STS Deep RIE Etcher stsetch |
STS Deep RIE Etcher Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching |
SVG Resist Coat Track 2 svgcoat2 |
SVG Resist Coat Tracks 1 and 2 Training | All | SNF Cleanroom Paul G Allen L107 |
Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal. |
SVG Resist Coat Track 1 svgcoat |
SVG Resist Coat Tracks 1 and 2 Training | All | SNF Cleanroom Paul G Allen L107 |
Automatic Resist spinning and bake |
SVG Develop Track 1 svgdev |
SVG Resist Develop tracks 1 and 2 Training | All | SNF Cleanroom Paul G Allen L107 |
Automatic development. |
SVG Develop Track 2 svgdev2 |
SVG Resist Develop tracks 1 and 2 Training | All | SNF Cleanroom Paul G Allen L107 |
Automatic development. |
Tencor P2 Profilometer p2 |
Tencor P2 Profilometer Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
Step height measurement range 500 Å to 80 µm |
Thermco1 Oxidation Furnace thermco1 |
Thermco Oxidation Furnaces Training | Clean | SNF Cleanroom Paul G Allen L107 |
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
Thermco3 Oxidation Furnace thermco 3 |
Thermco Oxidation Furnaces Training | Clean | SNF Cleanroom Paul G Allen L107 |
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
Thermco4 Oxidation Furnace thermco4 |
Thermco Oxidation Furnaces Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available. |
Ex Fab Develop Wet Bench wbexfab_dev |
WbExfab_Dev Training | Flexible | SNF Exfab Paul G Allen 104 Stinson |
Manual development of resist in beakers. SNF approved developers only. No solvents! |
Ex Fab Solvent Wet Bench wbexfab_solv |
WbExfab_Solv Training | Flexible | SNF Exfab Paul G Allen 104 Stinson |
Equipment name & Badger ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Minimum Resolution | Objective Separation | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
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micromanipulator6000 IV-CV probe station micromanipulator6000 |
All |
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1x4" wafer | ||||||
MRC Reactive Ion Etcher mrc |
Flexible |
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1 | |||||||
MVD mvd |
Flexible |
1 Å -
50 nm
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24 °C - 150 °C
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Nanospec 210XP nanospec2 |
All |
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Nanospec 3 nanospec3 |
All |
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Optomec Printer optomec-printer |
Flexible |
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Oven 110°C post-bake oven110 |
All |
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110 ºC
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Oven 90°C prebake oven90 |
All |
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90 ºC
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Oven BlueM 200°C to 430°C bluem |
Flexible |
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0 °C - 430 °C
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Oxford Dielectric Etcher oxford-rie |
Flexible |
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1 | ||||||
Oxford III-V etcher Ox-35 |
Flexible |
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1 | |||||||
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
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Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Flexible |
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1 | |||||||
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Flexible |
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1 | |||||||
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Flexible |
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1 | |||||||
Plasmaetch PE-50 plasma-etch |
Flexible |
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Multiple | |||||||
PlasmaTherm Shuttlelock PECVD System ccp-dep |
All |
100 Å -
4 μm
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100 °C - 350 °C
|
, , , , , , , , |
4 | ||||||
PlasmaTherm Versaline HDP CVD System hdpcvd |
All |
500 Å -
4 μm
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50 °C - 150 °C
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1 | |||||||
Prometrix Resistivity Mapping System prometrix |
All |
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1 | ||||||
Samco PC300 Plasma Etch System samco |
Flexible |
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20 ºC
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Four 4" wafers or two 6" wafers and one 8" wafer |