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4 inch wafer

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4"
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Equipment name & Badger ID Training Required & Chargessort ascending Cleanliness Lab Organization Location Notes
Lesker Sputter
lesker-sputter
Lesker Sputter Training Flexible SNF Exfab Paul G Allen 155A Venice

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Samco PC300 Plasma Etch System
samco
Samco Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Technics Asher
technics
Technics Asher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
LEI1500 Contactless Sheet Resistance Mapping Training All
SNF
SNF Exfab Paul G Allen 151 Ocean
Wet Bench Decontamination
wbdecon
Wet Bench Decontamination Training Clean
SNF
SNF Cleanroom Paul G Allen L107

KOH or wafersaw or post-cmp decontamination

Headway 3 Manual Resist Spinner
headway3
Headway 3 Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
Nanospec 3
nanospec3
Nanospec 3 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Keyence Digital Microscope VHX-6000
keyence
Keyence Training All
SNF
SNF Exfab Paul G Allen 104 Stinson
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Parylene Coater Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks
Heidelberg MLA 150
heidelberg
Heidelberg Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Direct Write

Heidelberg MLA 150 - 2
heidelberg2
Heidelberg Training All
SNF
SNF Cleanroom Paul G Allen L107

Direct Write

Thermolyne
thermolyne
Thermolyne Muffle Furnace Training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
AJA Evaporator
aja-evap
AJA Evaporation training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

PlasmaTherm Versaline HDP CVD System
hdpcvd
PlasmaTherm Versaline HDP CVD System Training All
SNF
SNF Cleanroom Paul G Allen L107

To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) .  Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Ebeam Process Wet Bench
wbebres
Ebeam Process Wet Bench Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual developing of Ebeam resist

White Oven
white-oven
White Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.

Flexus 2320 Stress Tester
stresstest
Flexus 2320 Stress Tester Training All
SNF
SNF Cleanroom Paul G Allen L107
Sensofar S-neox
s-neox
Sensofar S-neox Training All
SNF
SNF Cleanroom Paul G Allen L107

non contact 3D optical profiling

EV Group Wafer Bonder
evbond
EV Group Wafer Bonder Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Intlvac Evaporation
Intlvac_evap
Intlvac Evaporation Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

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Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
110°C Oven
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
90°C Oven
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Aix-ccs
aix-ccs
Special: See Notes Clean (MOCVD)
0 - 5 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
Aix200
aix200
Pre-Diffusion Clean, Special: See Notes Flexible
0 - 5 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Flexible
800 °C - 1100 °C
,
1x4" wafer or Copper/Nickel foil
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Semiclean
0 - 300 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Alphastep 500 Profilometer
alphastep
Flexible
,
,
,
,
,
,
,
,
1
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
Aw610_l
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer
Aw610_r
aw610_r
Flexible
21 °C - 1150 °C
,
,
Blue M Oven
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Critical Point Dryer
cpd
Flexible
,
,
,
,
,
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
Drytek 100 Plasma Etcher
drytek2
All
6
Ebeam Process Wet Bench
wbebres
Flexible
Epi2
epi2
Pre-Diffusion Clean Clean
50 Å - 3 μm
600 °C - 1200 °C
1
EV Group Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch
,
,
,
,
one piece or wafer
EV Group Wafer Bonder
evbond
Flexible
,
,
,
,
,
EVG 101 Spray Coater
evgspraycoat
All
,
,
,
,
1

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