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4 inch wafer

Short Name:

4"

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
Nanospec 3 nanospec3	Nanospec 3 Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Headway 3 Manual Resist Spinner headway3	Headway 3 Training	Flexible	SNF	SNF Exfab Paul G Allen 104 Stinson
Wet Bench Decontamination wbdecon	Wet Bench Decontamination Training	Clean	SNF	SNF Cleanroom Paul G Allen L107	KOH or wafersaw or post-cmp decontamination
LEI1500 Contactless Sheet Resistance Mapping eddycurrent	LEI1500 Contactless Sheet Resistance Mapping Training	All	SNF	SNF Exfab Paul G Allen 151 Ocean
Technics Asher technics	Technics Asher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Samco PC300 Plasma Etch System samco	Samco Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Lesker Sputter lesker-sputter	Lesker Sputter Training	Flexible	SNF Exfab	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

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Equipment name & Badger ID	Technique	Cleanliness	Primary Materials Etched	Material Thickness Range	Minimum Resolution	Developer	Objective Separation	Process Temperature Range	Chemicals	Gases	Substrate Size	Substrate Type	Maximum Load
Wet Bench Flexible Solvents 2 wbflexsolv-2	Cleaning > Solvent Cleaning Cleaning > Resist Removal > Wet Resist Removal	Flexible							Solvents		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various)
Wet Bench Germanium wbgen2	Cleaning > Pre-Diffusion Clean: Germanium	Clean (Ge)							50:1 HF		4"	(Ge)	25
Wet Bench Miscellaneous wbmiscres	Optical Photolithography > Resist Develop > Resist Develop (manual)	Flexible				Developers MF-26A developer			Developers		Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Wet Bench Resist Strip wbresstrip-1	Cleaning > Resist Removal > Wet Resist Removal	Clean (Ge), Semiclean, Flexible	Resist					20 °C - 60 °C	PRS-1000 SRS-100		Pieces 2" 3" 4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC)	25 4 inch wafers
White Oven white-oven	Optical Photolithography > Resist Bake > Oven Bake	Flexible						0 °C - 200 °C			Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (GaN) , (III-V) , (GaAs)
Woollam woollam	Characterization > Ellipsometry	All									Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb) , (Various)	1
Xactix Xenon Difluoride Etcher xactix	Etching > Vapor Etching	All	Ge Si SiGe							N₂ XeF₂	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1

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