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4 inch wafer

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4"
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Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
Oxford Dielectric Etcher
oxford-rie
Oxford Dielectric Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

Oxford III-V etcher
Ox-35
Oxford III-V etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.

Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching

Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Plasma Therm Versaline LL ICP Dielectric Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Plasma Therm Versaline LL ICP Metal Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Plasmaetch PE-50
plasma-etch
Plasmaetch PE-50 Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks

Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab

PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All
SNF
SNF Cleanroom Paul G Allen L107

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All
SNF
SNF Cleanroom Paul G Allen L107

3 Probe Heads for different Cleanliness

Sinton Lifetime Tester
sinton-lifetime-tester
Sinton Lifetime Tester Training Flexible
SNF
SNF Exfab Paul G Allen 151 Ocean
SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All
SNF
SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

STS Deep RIE Etcher
stsetch
STS Deep RIE Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching

STS Plasma Enhanced CVD
sts
STS Plasma Enhanced CVD Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

SVG Resist Coat Track 1
svgcoat
SVG Resist Coat Tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic Resist spinning and bake

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

Automatic development.

Tencor P2 Profilometer
p2
Tencor P2 Profilometer Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Step height measurement range 500 Å to 80 µm

Thermco1
thermco1
Thermco Oxidation Furnaces Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.

Thermco3
thermco 3
Thermco Oxidation Furnaces Training Clean
SNF
SNF Cleanroom Paul G Allen L107

Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.

Thermco4
thermco4
Thermco Oxidation Furnaces Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.

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Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Resist Objective Separation Process Temperature Range Chemicals Gases Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
Laurell Manual Resist Spinner
laurell-R
All
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
,
1 wafer(2" to 8")
Lesker Sputter
lesker-sputter
Flexible
,
,
,
,
,
,
,
,
,
1 4 inch wafer, 1 6 inch wafer
Lesker2 Sputter
lesker2-sputter
Semiclean
1 μm
°C - 800 °C
,
,
,
,
,
,
,
,
,
one 4 inch wafer, one 6 inch wafer
Lithography Solvent Bench
lithosolv
Flexible
,
,
,
,
,
,
,
,
Matrix Plasma Resist Strip
matrix
Flexible
,
,
,
,
25
micromanipulator6000 IV-CV probe station
micromanipulator6000
All
,
,
,
,
,
,
,
,
,
,
,
1x4" wafer
MRC Reactive Ion Etcher
mrc
Flexible
1
MVD
mvd
Flexible
1 Å - 50 nm
24 °C - 150 °C
Nanospec 210XP
nanospec2
All
,
,
,
,
,
,
,
,
Nanospec 3
nanospec3
Flexible
Optomec Printer
optomec-printer
Flexible
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
Oxford III-V etcher
Ox-35
Flexible
1
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible
,
,
,
,
,
,
,
,
,
,
,
,
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
1
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Plasmaetch PE-50
plasma-etch
Flexible
Multiple
PlasmaTherm Shuttlelock PECVD System
ccp-dep
Special: See Notes All
100 Å - 4 μm
100 °C - 350 °C
4

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