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4 inch wafer

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Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
EV Group Contact Aligner
evalign
EV Group Contact Aligner Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

EVG 101 Spray Coater
evgspraycoat
EVG 101 Spray Coater Training All
SNF
SNF Cleanroom Paul G Allen L107

Spray coating of resists

Finetech Lambda
flipchipbonder
Flip Chip Bonder Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
First Nano carbon nanotube CVD furnace
cvd-nanotube
cvd-nanotube training Flexible
SNF
SNF Exfab Paul G Allen L119 Año Nuevo

Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density

Tylanfga
tylanfga
Forming Gas Anneal Furnace Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

For standard metals deposited in Lesker2, Intlvac Sputter or Intlvac Evaporation only. N2 and Ar annealing available. Please contact staff for more information.

Tylan9
tylan9
Forming Gas Anneal Furnace Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Any material that won't vaporize is okay. N2 and Ar annealing available.

Gasonics Aura Asher
gasonics
Gasonics Aura Asher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.

Headway Manual Resist Spinner
headway2
Headway Manual Resist Spinner Training All
SNF
SNF Cleanroom Paul G Allen L107

Adjustable spin speeds, spin time. SNF-acceptable resists or polymers. Ebeam resists

Woollam
woollam
Woollam Training All
SNF
SNF Cleanroom Paul G Allen L107
Karl Suss MA-6 Contact Aligner 2
karlsuss2
Karl Suss MA-6 Contact Aligner 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align.

Karl Suss MA-6 Contact Aligner 1
karlsuss
Karl Suss MA-6 Contact Aligner 1 and 2 Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Backside align, including IR.

Lam Research TCP 9400 Poly Etcher
lampoly
Lam Research TCP 9400 Poly Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.

Laurell Manual Resist Spinner
laurell-R
Laurell Manual Resist Spinner Training All
SNF
SNF Cleanroom Paul G Allen L107

SU-8, LOL, Ebeam resists allowed. No Acetone allowed. 

Lesker2 Sputter
lesker2-sputter
Lesker2 Sputter Training Semiclean
SNF
SNF Cleanroom Paul G Allen L107

reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter

Lithography Solvent Bench
lithosolv
Lithography Solvent Bench Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or masks. Teflon coated metal tweezers cleaning.

Matrix Plasma Resist Strip
matrix
Matrix Plasma Resist Strip Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.

micromanipulator6000 IV-CV probe station
micromanipulator6000
micromanipulator6000 IV-CV probe station Training All
SNF
SNF Exfab Paul G Allen 151 Ocean
MRC Reactive Ion Etcher
mrc
MRC Reactive Ion Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode

Nanospec 210XP
nanospec2
Nanospec Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Å

Optomec Printer
optomec-printer
Optomec Printer Training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

Pages

Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Materials User Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Ex Fab Develop Wet Bench
wbexfab_dev
Flexible
Ex Fab Solvent Wet Bench
wbexfab_solv
Flexible
Fiji 1
fiji1
Semiclean
1 Å - 50 nm
24 °C - 350 °C
,
,
Fiji 2
fiji2
Flexible
1 Å - 50 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Fiji 3
fiji3
Flexible
1 Å - 50 nm
24 °C - 350 °C
,
,
Finetech Lambda
flipchipbonder
Flexible
°C - 400 °C
,
,
,
,
,
1
First Nano carbon nanotube CVD furnace
cvd-nanotube
Flexible
800 °C - 1100 °C
,
1x4" wafer or multiple pieces
Flexus 2320 Stress Tester
stresstest
All
,
,
,
,
,
,
,
,
1
Gasonics Aura Asher
gasonics
Clean, Semiclean
25
Headway 3 Manual Resist Spinner
headway3
Flexible
1 piece or wafer
Headway Manual Resist Spinner
headway2
All
,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm
,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,
Innotec Evaporator
Innotec
Flexible
,
,
22 four inch wafers
Intlvac Evaporation
Intlvac_evap
Clean, Semiclean
0 - 1 μm
,
,
12 4 inch wafers, 2 6 inch wafers
Karl Suss MA-6 Contact Aligner 1
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch
,
,
,
,
,
,
,
,
,
Karl Suss MA-6 Contact Aligner 2
karlsuss2
All
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch
,
,
,
,
,
,
,
,
,
Keyence Digital Microscope VHX-6000
keyence
All
,
,
,
,
,
,
,
,
Lam Research TCP 9400 Poly Etcher
lampoly
Clean, Semiclean
,
25

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