Equipment name & NEMO ID | Training Required & Charges | Cleanliness | Location | Notes |
---|---|---|---|---|
PlasmaTherm Shuttlelock PECVD System ccp-dep |
PlasmaTherm Shuttlelock PECVD System Training | All | SNF Cleanroom Paul G Allen L107 |
To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing - Substrates in clean category: Pre-Diffusion Clean For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run |
Plasmaetch PE-50 plasma-etch |
Plasmaetch PE-50 Training | Flexible | SNF Exfab Paul G Allen 155 Mavericks |
Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab |
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Plasma Therm Versaline LL ICP Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Parylene Coater Training | Flexible | SNF Exfab Paul G Allen 155 Mavericks | |
Oxford III-V etcher Ox-35 |
Oxford III-V etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only. |
Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
Oven BlueM 200°C to 430°C bluem |
Blue M Oven Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Convection in N2. Cure. Programmable. |
Oven 90°C prebake oven90 |
Resist Prebake Oven 90°C Training | All | SNF Cleanroom Paul G Allen L107 |
Bakes wafers after resist coating. |
Oven 110°C post-bake oven110 |
Resist Postbake Oven 110°C Training | All | SNF Cleanroom Paul G Allen L107 |
Bakes wafers with resist after the development, called post-bake. |
Oven (White) white-oven |
White Oven Training | Flexible | SNF Cleanroom Paul G Allen L107 |
For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable. |
Optomec Printer optomec-printer |
Optomec Printer Training | Flexible | SNF Exfab Paul G Allen 155A Venice | |
Nanospec 3 nanospec3 |
Nanospec 3 Training | All | SNF Cleanroom Paul G Allen L107 | |
Nanospec 210XP nanospec2 |
Nanospec Training | All | SNF Exfab Paul G Allen 104 Stinson |
Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Ã |
MVD mvd |
MVD Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Reactor located inside glovebox |
MRC Reactive Ion Etcher mrc |
MRC Reactive Ion Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode |
micromanipulator6000 IV-CV probe station micromanipulator6000 |
micromanipulator6000 IV-CV probe station Training | All | SNF Exfab Paul G Allen 151 Ocean | |
Matrix Plasma Resist Strip matrix |
Matrix Plasma Resist Strip Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
Lesker2 Sputter lesker2-sputter |
Sputter Lesker 1&2 Training | Semiclean | SNF Cleanroom Paul G Allen L107 |
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Materials Lab Supplied | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|
PlasmaTherm Shuttlelock PECVD System ccp-dep |
All |
100.00 Å -
4.00 μm
|
100 °C - 350 °C
|
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4 | ||||||
Plasmaetch PE-50 plasma-etch |
Flexible | Multiple | |||||||||
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Flexible | 1 | |||||||||
Plasma Therm Versaline LL ICP Dielectric Etcher PT-Ox |
Flexible | 1 | |||||||||
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Flexible | 1 | |||||||||
PDS 2010 LABCOTER™ 2 Parylene Deposition System parcoater |
Flexible |
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|||||||||
Oxford III-V etcher Ox-35 |
Flexible | 1 | |||||||||
Oxford Dielectric Etcher oxford-rie |
Flexible |
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1 | ||||||||
Oven BlueM 200°C to 430°C bluem |
Flexible |
0 °C - 430 °C
|
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||||||||
Oven 90°C prebake oven90 |
All |
90 ºC
|
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Oven 110°C post-bake oven110 |
All |
110 ºC
|
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Oven (White) white-oven |
Flexible |
0 °C - 200 °C
|
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||||||||
Optomec Printer optomec-printer |
Flexible | ||||||||||
Nanospec 3 nanospec3 |
All | ||||||||||
Nanospec 210XP nanospec2 |
All |
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|||||||||
MVD mvd |
Flexible |
1.00 Å -
50.00 nm
|
24 °C - 150 °C
|
||||||||
MRC Reactive Ion Etcher mrc |
Flexible | 1 | |||||||||
micromanipulator6000 IV-CV probe station micromanipulator6000 |
All |
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1x4" wafer | ||||||||
Matrix Plasma Resist Strip matrix |
Flexible |
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25 | ||||||||
Lesker2 Sputter lesker2-sputter |
Semiclean |
1.00 μm
|
°C - 800 °C
|
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one 4 inch wafer, one 6 inch wafer |