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4 inch wafer

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4"
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Equipment name & Badger ID Training Required & Charges Cleanliness Lab Organization Location Notes
110°C Oven
oven110
110°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers with resist after the development, called post-bake.

90°C Oven
oven90
90°C Oven Training All
SNF
SNF Cleanroom Paul G Allen L107

Bakes wafers after resist coating.

Aix-ccs
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD)
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

Aix200
aix200
Aixtron MOCVD - III-V system training Flexible
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip.

Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Aixtron Black Magic graphene CVD furnace training Flexible
SNF
SNF Exfab Paul G Allen L119 Año Nuevo
AJA Evaporator
aja-evap
AJA Evaporation training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

AJA2 Evaporator
aja2-evap
AJA2 Evaporator Semiclean
SNF
SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Alphastep 500 Profilometer
alphastep
Alphastep 500 Profilometer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

500Å to 300µm

AMT Oxide Plasma Etcher
amtetcher
AMT Oxide Plasma Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Batch processing tool with hexode configuration; pieces need to be mounted on a carrier wafer for etching

ASML PAS 5500/60 i-line Stepper
asml
ASML PAS 5500/60 i-line Stepper Training All
SNF
SNF Cleanroom Paul G Allen L107

5:1 reducing stepper

Aw610_l
aw610_l
AllWin 610 RTA Training Clean
SNF
SNF Cleanroom Paul G Allen L107
Aw610_r
aw610_r
AllWin 610 RTA Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Blue M Oven
bluem
Blue M Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Convection in N2. Cure. Programmable.

Critical Point Dryer
cpd
Critical Point Dryer Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

CO2 drying after release of micromachined devices

Digital Instruments AFM Nanoscope Dimension 3000
afm2
Digital Instruments AFM Nanoscope Dimension 3000 Training All
SNF
SNF Exfab Paul G Allen 104 Stinson

Atomic Force Microscope. Step Profile

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola
Drytek 100 Plasma Etcher
drytek2
Drytek 100 Plasma Etcher Training All
SNF
SNF Cleanroom Paul G Allen L107

Batch processing tool; 6 stacked electrodes; no clamp; wafers and pieces can be loaded directly on the grounded electrode

Ebeam Process Wet Bench
wbebres
Ebeam Process Wet Bench Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual developing of Ebeam resist

Epi2
epi2
AMAT Centurion Epitaxial Training Clean
SNF
SNF Cleanroom Paul G Allen L107

N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr

EV Group Contact Aligner
evalign
EV Group Contact Aligner Training All
SNF
SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

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Equipment name & Badger ID Technique Cleaning Required Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Objective Separation Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
110°C Oven
oven110
All
110 ºC
,
,
,
,
,
,
,
,
,
90°C Oven
oven90
All
90 ºC
,
,
,
,
,
,
,
,
Aix-ccs
aix-ccs
Special: See Notes Clean (MOCVD)
0 - 5 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
Aix200
aix200
Pre-Diffusion Clean, Special: See Notes Flexible
0 - 5 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Flexible
800 °C - 1100 °C
,
1x4" wafer or Copper/Nickel foil
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Semiclean
0 - 300 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Alphastep 500 Profilometer
alphastep
Flexible
,
,
,
,
,
,
,
,
1
AMT Oxide Plasma Etcher
amtetcher
Clean, Semiclean
24
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
Aw610_l
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer
Aw610_r
aw610_r
Flexible
21 °C - 1150 °C
,
,
Blue M Oven
bluem
Flexible
0 °C - 430 °C
,
,
,
,
,
,
,
,
,
Critical Point Dryer
cpd
Flexible
,
,
,
,
,
,
,
,
,
Digital Instruments AFM Nanoscope Dimension 3000
afm2
All
DISCO Wafer Saw
DISCO wafersaw
Flexible
,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
Drytek 100 Plasma Etcher
drytek2
All
6
Ebeam Process Wet Bench
wbebres
Flexible
Epi2
epi2
Pre-Diffusion Clean Clean
50 Å - 3 μm
600 °C - 1200 °C
1
EV Group Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch
,
,
,
,
one piece or wafer

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