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4 inch wafer

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Equipment name & Badger ID Training Required & Charges Cleanliness Location Notes
Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Aixtron Black Magic graphene CVD furnace training Flexible SNF Exfab Paul G Allen L119 Año Nuevo
Aixtron MOCVD - III-N system
aix-ccs
Aixtron MOCVD - III-N system training Clean (MOCVD) SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For Sapphire clean: SC1, SC2.
For GaN template on Si or Sapphire: Piranha, SC1, SC2.

Aixtron MOCVD - III-V system
aix200
Aixtron MOCVD - III-V system training Flexible SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip.

AJA Evaporator
aja-evap
AJA Evaporation training Flexible SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

AJA2 Evaporator
aja2-evap
AJA2 Evaporator Semiclean SNF Cleanroom Paul G Allen L107

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

AllWin 610 RTA
aw610_l
AllWin 610 RTA Training Clean SNF Cleanroom Paul G Allen L107
AllWin 610 RTA (aw610_r)
aw610_r
AllWin 610 RTA Training Flexible SNF Cleanroom Paul G Allen L107
Alphastep 500 Profilometer
alphastep
Alphastep 500 Profilometer Training Flexible SNF Exfab Paul G Allen 104 Stinson

500Å to 300µm

AMAT Centurion Epitaxial System
epi2
AMAT Centurion Epitaxial Training Clean SNF Cleanroom Paul G Allen L107

N and P doping available- intrinsic to 5E19 Operating pressure range is 5-300Torr

ASML PAS 5500/60 i-line Stepper
asml
ASML PAS 5500/60 i-line Stepper Training All SNF Cleanroom Paul G Allen L107

5:1 reducing stepper

DISCO Wafer Saw
DISCO wafersaw
DISCO wafersaw training Flexible SNF Exfab Paul G Allen 159 Capitola
EV Group Contact Aligner
evalign
EV Group Contact Aligner Training All SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

EV Group Wafer Bonder
evbond
EV Group Wafer Bonder Training Flexible SNF Cleanroom Paul G Allen L107
EVG 101 Spray Coater
evgspraycoat
EVG 101 Spray Coater Training All SNF Cleanroom Paul G Allen L107

Spray coating of resists

Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible SNF Exfab Paul G Allen 104 Stinson

Manual development of resist in beakers. SNF approved developers only. No solvents!

Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible SNF Exfab Paul G Allen 104 Stinson
Fiji 1 ALD
fiji1
Fiji 1 and 2 ALD Training Semiclean SNF Cleanroom Paul G Allen L107
Fiji 2 ALD
fiji2
Fiji 1 and 2 ALD Training Flexible SNF Cleanroom Paul G Allen L107
Fiji 3 ALD
fiji3
Fiji 3 ALD Training Flexible SNF Cleanroom Paul G Allen L107

Restricted to non-conductive films only

Finetech Lambda
flipchipbonder
Flip Chip Bonder Training Flexible SNF Exfab Paul G Allen 104 Stinson

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Equipment name & Badger ID Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Developer Process Temperature Range Chemicals Gases Substrate Size Substrate Type Maximum Load
Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Flexible
800 °C - 1100 °C
,
1x4" wafer or Copper/Nickel foil
Aixtron MOCVD - III-N system
aix-ccs
Clean (MOCVD)
0.00 - 5.00 μm
400 °C - 1300 °C
,
,
,
4"x1, 2"X3, pieces
Aixtron MOCVD - III-V system
aix200
Pre-Diffusion Clean Flexible
0.00 - 5.00 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
AJA Evaporator
aja-evap
Flexible
0.00 - 300.00 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AJA2 Evaporator
aja2-evap
Semiclean
0.00 - 300.00 nm
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
AllWin 610 RTA
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer
AllWin 610 RTA (aw610_r)
aw610_r
Flexible
21 °C - 1150 °C
,
,
Alphastep 500 Profilometer
alphastep
Flexible ,
,
,
,
,
,
,
,
1
AMAT Centurion Epitaxial System
epi2
Pre-Diffusion Clean Clean
50.00 Å - 3.00 μm
600 °C - 1200 °C
1
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
DISCO Wafer Saw
DISCO wafersaw
Flexible ,
,
,
,
,
,
,
,
1x4", 1x6" or 1x8" wafer, or pieces
EV Group Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch ,
,
,
,
one piece or wafer
EV Group Wafer Bonder
evbond
Flexible ,
,
,
,
,
EVG 101 Spray Coater
evgspraycoat
All ,
,
,
,
1
Ex Fab Develop Wet Bench
wbexfab_dev
Flexible
Ex Fab Solvent Wet Bench
wbexfab_solv
Flexible
Fiji 1 ALD
fiji1
Semiclean
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Fiji 2 ALD
fiji2
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
,
,
,
,
,
,
,
,
,
,
Fiji 3 ALD
fiji3
Flexible
1.00 Å - 50.00 nm
24 °C - 350 °C
,
,
Finetech Lambda
flipchipbonder
Flexible
°C - 400 °C
,
,
,
,
,
1

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