Use of Stycast Epoxy for Non-galvanic Flip-chip Bonding
PROM Request Title:
Use of Stycast Epoxy for Non-galvanic Flip-chip Bonding
PROM Request Summary:
Documentation of procedure to use epoxy in flip-chip bonder.
PROM Date:
11/15/2019
PROM Decision:
Approved.
Link to PROM Request and supporting documentation:
Equipment List:
