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Solder Paste and Spheres for Finetech Bonding

PROM Request Title: 
Solder Paste and Spheres for Finetech Bonding
PROM Request Summary: 
Use of Pb-containing paste and spheres for soldering using Finetech Flip Chip Bonder.
PROM Date: 
10/12/2016
PROM Decision: 
Approved. Use of portable HEPA filter required due to Pb-containing materials.