GE Varnish for non-galvanic flip chip bonding
PROM Request Title:
GE Varnish for non-galvanic flip chip bonding
PROM Request Summary:
Modified PROM request to use GE Varnish instead of Indium for bonding in flip chip bonder.
PROM Date:
11/19/2020
PROM Decision:
Request approved.
Link to PROM Request and supporting documentation:
Equipment List:
