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BCB use for wafer bonding and subsequent polishing

PROM Request Title: 
BCB use for wafer bonding and subsequent polishing
PROM Request Summary: 
Use of new bonding chemical in SNF.
PROM Date: 
12/13/2021
PROM Decision: 
Request approved. Etch restricted to Ox-RIE.
Link to PROM Request and supporting documentation: 
BCB use for wafer bonding and subsequent polishing