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Variable Trench Optimization for DRIE of SOI in PT-DSE

Project Type: 
E241
Date: 
June 2015
Areas of Interest: 
DRIE, SOI, PT-DSE
Report(s): 
Variable Trench Optimization for DRIE of SOI in PT-DSE- Final Report
Processing Technique (former Function and Method): 
Reactive Ion Etching (RIE)
Researchers and (Mentors): 
Ian Flader, Yunhan Chen, (Usha Raghuram)
List of Important Equipment: 
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Presentation(s): 
Variable Trench Optimization for DRIE of SOI in PT-DSE- Final Presentation