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Surface Micromachining Method for Releasing a Range of Micron-Scale Membranes

Project Type:

E241

Date:

December 2014

Areas of Interest:

MEMS, release strategies

Report(s):

Surface Micromachining Method for Releasing a Range of Micron-Scale Membranes- Final Report

Function and Method:

Atomic Layer Deposition (ALD)

Reactive Ion Etching (RIE)

Wafer Polishing

Researchers and (Mentors):

Martin Winterkorn, Anup Dadlani, Yongmin Kim, (J Provine), (Michelle Rincon)

List of Important Equipment:

ThermcoPoly2 (thermcopoly2)

GnP POLI-400L (cmp)

Xactix Xenon Difluoride Etcher (xactix)

Sensofar S-neox (s-neox)

ASML PAS 5500/60 i-line Stepper (asml)

Presentation(s):

Surface micromachining method for releasing a range of micron-scale membranes- Final Presentation

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