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Smooth Sidewall Etching in PT-DSE
Project Type:
E241
Date:
December 2014
Areas of Interest:
High aspect ratio etches with smooth sidewalls, 'Bosch' process recipes
Function and Method:
Reactive Ion Etching (RIE)
Researchers and (Mentors):
Andrew Ceballos, Stephen Hamann, (Usha Raghuram)
List of Important Equipment:
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Report(s):
Smooth sidewall etching in the PT-DSE- Final Report
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