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Smooth Sidewall Etching in PT-DSE

Project Type: 
E241
Date: 
December 2014
Areas of Interest: 
High aspect ratio etches with smooth sidewalls, 'Bosch' process recipes
Function and Method: 
Reactive Ion Etching (RIE)
Researchers and (Mentors): 
Andrew Ceballos, Stephen Hamann, (Usha Raghuram)
List of Important Equipment: 
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Report(s): 
Smooth sidewall etching in the PT-DSE- Final Report