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Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils
Project Type:
E241
Date:
December 2016
Areas of Interest:
Flip Chip Bonding
Function and Method:
Bonding
Researchers and (Mentors):
Karen Dowling, Mimi Yang, (J Provine), (Usha Raghuram), (Astrid Tomada)
List of Important Equipment:
Finetech Lambda (flipchipbonder)
Presentation(s):
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Presentation
Report(s):
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils- Final Report
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