Skip to content Skip to navigation

Sapphire flip-­chip thermocompression and eutectic bonding for dielectric laser accelerator

Project Type: 
E241
Date: 
December 2016
Areas of Interest: 
Flip Chip Bonding
Report(s): 
Sapphire flip-chip thermocompression and eutectic bonding for dielectric laser accelerator- Final Report
Processing Technique (former Function and Method): 
Bonding
Researchers and (Mentors): 
Huiyang Deng, Yu Miao, (Usha Raghuram)
List of Important Equipment: 
Finetech Lambda (flipchipbonder)
Presentation(s): 
Sapphire Flip-chip Thermocompression and Eutectic Bonding for Dielectric Laser Accelerator- Final Presentation