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Sapphire flip-­chip thermocompression and eutectic bonding for dielectric laser accelerator

Project Type: 
E241
Date: 
December 2016
Areas of Interest: 
Flip Chip Bonding
Function and Method: 
Researchers and (Mentors): 
Huiyang Deng, Yu Miao, (Usha Raghuram)
List of Important Equipment: