Skip to content
Skip to navigation
SUNetID Login
SUNetID Login
Stanford Nanofabrication Facility
SNF is open under
New Normal Rules
. ANY shadowing must be coordinated with SNF staff first.
Stanford Nanofabrication Facility
Navigation menu
SNF Main Menu
SNF Home
About
Overview
Mission
History
NNCI
Lab Spaces
Visit
Join
Overview
Getting Started in the SNF labs
Contacts
Rates
How to Join
Forms
Discussion Lists
Storage
Lab User Guide
Main menu
Home
Sapphire flip-chip thermocompression and eutectic bonding for dielectric laser accelerator
Project Type:
E241
Date:
December 2016
Areas of Interest:
Flip Chip Bonding
Function and Method:
Bonding
Researchers and (Mentors):
Huiyang Deng, Yu Miao, (Usha Raghuram)
List of Important Equipment:
Finetech Lambda (flipchipbonder)
Presentation(s):
Sapphire Flip-chip Thermocompression and Eutectic Bonding for Dielectric Laser Accelerator- Final Presentation
Report(s):
Sapphire flip-chip thermocompression and eutectic bonding for dielectric laser accelerator- Final Report
Printer-friendly version