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Sapphire flip-chip thermocompression and eutectic bonding for dielectric laser accelerator
Project Type:
E241
Date:
December 2016
Areas of Interest:
Flip Chip Bonding
Report(s):
Sapphire flip-chip thermocompression and eutectic bonding for dielectric laser accelerator- Final Report
Processing Technique (former Function and Method):
Bonding
Researchers and (Mentors):
Huiyang Deng, Yu Miao, (Usha Raghuram)
List of Important Equipment:
Finetech Lambda (flipchipbonder)
Presentation(s):
Sapphire Flip-chip Thermocompression and Eutectic Bonding for Dielectric Laser Accelerator- Final Presentation