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Rapid fabrication of curved metasurfaces through wafer grinding

Project Type: 
E241
Date: 
June 2022
Areas of Interest: 
Wafer Grinding, PDMS processing, Creating PDMS molds
Report(s): 
Rapid fabrication of curved metasurfaces through wafer grinding
Researchers and (Mentors): 
Robert Lupoiu, Chenkai Mao, Yixuan Shao, (Swaroop Kommera), (Lavendra Mandyam), (J Provine)
List of Important Equipment: 
DISCO Backgrinder (disco-backgrind)
PDMS Workbench ()
Heidelberg MLA 150 (heidelberg)
Heidelberg MLA 150 - 2 (heidelberg2)
Nano Nugget(s): 

Wafer protection using blue sticky tape for spin-coating PDMS

Using the drop gauge to measure the thickness and compression amount of PDMS films

Creating molds for the casting of thick, uniform PDMS