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Optimization of Silicon Isotropic Plasma Etch in PT-DSE for GOPHER Process

Project Type: 
E241
Date: 
December 2015
Areas of Interest: 
Optimizing Isotropic etching in the PT-DSE
Report(s): 
Optimization of Silicon Isotropic Plasma Etch in PT­DSE for GOPHER Process- Final Report
Function and Method: 
Reactive Ion Etching (RIE)
Researchers and (Mentors): 
Andrew Ceballos, (Usha Raghuram)
List of Important Equipment: 
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Presentation(s): 
Optimization of Isotropic Plasma Etch in PT-DSE for GOPHER Process- Final Presentation