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Optimization of Silicon Isotropic Plasma Etch in PT-DSE for GOPHER Process
Project Type:
E241
Date:
December 2015
Areas of Interest:
Optimizing Isotropic etching in the PT-DSE
Report(s):
Optimization of Silicon Isotropic Plasma Etch in PTĀDSE for GOPHER Process- Final Report
Function and Method:
Reactive Ion Etching (RIE)
Researchers and (Mentors):
Andrew Ceballos, (Usha Raghuram)
List of Important Equipment:
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Presentation(s):
Optimization of Isotropic Plasma Etch in PT-DSE for GOPHER Process- Final Presentation
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