Skip to content Skip to navigation

Low Temperature Bonding for Neural Implant Fabrication

Project Type: 
E241
Date: 
June 2018
Areas of Interest: 
Bonding of 3D structures to chips
Function and Method: 
Researchers and (Mentors): 
Pingyu Wang, Timothy Goh, (Usha Raghuram)
List of Important Equipment: 
Nano Nugget(s): 

“Tips” or “tricks” on use of the Lambda Flipchip Bonder and the integration with lithography and metallization steps that are used in preparation for bonding.