Low Temperature Bonding for Neural Implant Fabrication
Areas of Interest:
Bonding of 3D structures to chips
Researchers and (Mentors):
Pingyu Wang, Timothy Goh, (Usha Raghuram)
List of Important Equipment:
“Tips” or “tricks” on use of the Lambda Flipchip Bonder and the integration with lithography and metallization steps that are used in preparation for bonding.