Step-by-step procedures and processing tips for fabrication of an SiOx hardmask for deep silicon etch in the SNF.
Tips for using the Keyence to image cross sections of wafer pieces. This can be used as a quick check before X-SEM.
This document contains standard operating procedures (SOPs) for the following processes: 1.Fabrication of oxide hard mask for deep silicon etching. 2.Tapered etch method for blade formation using PT-DSE 3.Through-hole etching using PT-DSE
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