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Fabrication of an Etched Silicon Microdissection Platform with Applications in Organotypic Culture and Personalized Immunotherapy Testing

Project Type: 
E241
Date: 
March 2020
Areas of Interest: 
Silicon patterning for tissue cutting
Report(s): 
F19- Fabrication of an Etched Silicon Microdissection Platform with Applications in Organotypic Culture and Personalized Immunotherapy Testing
W20- Fabrication of an Etched Silicon Platform with Applications in Uniform Dissection of Biological Samples Final Report
Processing Technique (former Function and Method): 
Inductively Coupled Plasma Etching (ICP)
Researchers and (Mentors): 
Nicolas Castaño, Seth Cordts, Saisneha Koppaka (Usha Raghuram), (Tony Ricco), (Mark Zdeblick)
List of Important Equipment: 
Plasma Therm Versaline LL ICP Deep Silicon Etcher (PT-DSE)
Nano Nugget(s): 

SOP- Silicon Oxide Hardmask for Si Etching in PT-DSE

Step-by-step procedures and processing tips for fabrication of an SiOx hardmask for deep silicon etch in the SNF.

Tips- Using Keyence for X-sectional Imaging

Tips for using the Keyence to image cross sections of wafer pieces. This can be used as a quick check before X-SEM.

SOP- Fabrication of an Etched Silicon Platform with Applications in Uniform Dissection of Biological Samples

This document contains standard operating procedures (SOPs) for the following processes: 1.Fabrication of oxide hard mask for deep silicon etching. 2.Tapered etch method for blade formation using ​PT-DSE 3.Through-hole etching using ​PT-DSE

Presentation(s): 
MicroTissue Dicer- Fall Quarter Final Presentation