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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy. For more information please click here.

The following is a list of equipment that fall into the "Flexible" category.

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Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Developer Objective Separation Process Temperature Range Chemicals Substrate Size Substrate Type Maximum Load
Wet Bench Miscellaneous
wbmiscres
Flexible
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Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
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25 4 inch wafers
White Oven
white-oven
Flexible
0 °C - 200 °C
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,
Xplore Micro Compounder
N/A
Flexible
0 °C - 400 °C

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