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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy. For more information please click here.

The following is a list of equipment that fall into the "Flexible" category.

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Equipment name & Badger IDsort ascending Training Required & Charges Cleanliness Lab Organization Location Notes
AJA Evaporator
aja-evap
AJA Evaporation training Flexible
SNF
SNF Exfab Paul G Allen 155A Venice

For more than 300nm deposition, please contact Graham Ewing<grahamj.ewing@stanford.edu> in advance

Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Aixtron Black Magic graphene CVD furnace training Flexible
SNF
SNF Exfab Paul G Allen L119 Año Nuevo
Aix200
aix200
Aixtron MOCVD - III-V system training Flexible
SNF
SNF MOCVD Paul G Allen 213XA

N and P doping available.
For Si clean: SC1, SC2, HF dip.
For III-V clean: HCl or HF dip.

AFM-Asylum
afm-asylum
AFM-Asylum Training Flexible
SNF
SNF Exfab Paul G Allen 151 Ocean

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Equipment name & Badger IDsort ascending Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Minimum Resolution Objective Separation Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
AJA Evaporator
aja-evap
Flexible
0 - 300 nm
,
,
,
,
,
,
,
,
,
,
,
4"x3 or 6"x1 wafers or pieces
Aixtron Black Magic graphene CVD furnace
aixtron-graphene
Flexible
800 °C - 1100 °C
,
1x4" wafer or Copper/Nickel foil
Aix200
aix200
Pre-Diffusion Clean, Special: See Notes Flexible
0 - 5 μm
300 °C - 800 °C
,
,
,
4"x1 wafer or 2"x1 wafer or 4 pieces
AFM-Asylum
afm-asylum
Flexible

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