Skip to content Skip to navigation

Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy. For more information please click here.

The following is a list of equipment that fall into the "Flexible" category.

Subscribe to
Equipment name & Badger ID Training Required & Charges Cleanliness Lab Organization Location Notes
Wet Bench Miscellaneous
wbmiscres 		Wet Bench Miscellaneous Photoresist Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!
Wet Bench Resist Strip
wbresstrip-1 		Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible
SNF
SNF Cleanroom Paul G Allen L107

Wet Resist Removal: SRS-100 or PRS1000
White Oven
white-oven 		White Oven Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

For LOL2000 bake or bakes which are not allowed in the other ovens and need higher temperatures, up to 200C, programmable.
Xplore Micro Compounder
N/A 		Micro Compounder training Flexible
SNF
SNF Exfab Paul G Allen 159 Capitola

Pages

Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Developer Objective Separation Process Temperature Range Chemicals Substrate Size Substrate Type Maximum Load
Wet Bench Miscellaneous
wbmiscres
Flexible
(Si)
,
(SiGe)
,
(SiO2)
,
(Al2O3)
,
(SiO2)
,
(Ge)
,
(GaN)
,
(III-V)
,
(GaAs)
Wet Bench Resist Strip
wbresstrip-1
Clean (Ge), Semiclean, Flexible
20 °C - 60 °C
(Si)
,
(SiGe)
,
(SiO2)
,
(Al2O3)
,
(SiO2)
,
(Ge)
,
(SiC)
 25 4 inch wafers
White Oven
white-oven
Flexible
0 °C - 200 °C
(Si)
,
(SiGe)
,
(SiO2)
,
(Al2O3)
,
(SiO2)
,
(Ge)
,
(GaN)
,
(III-V)
,
(GaAs)
Xplore Micro Compounder
N/A
Flexible
0 °C - 400 °C

Pages