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Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy. For more information please click here.

The following is a list of equipment that fall into the "Flexible" category.

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Equipment name & Badger ID Training Required & Chargessort descending Cleanliness Lab Organization Location Notes
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Plasma Therm Versaline LL ICP Metal Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Plasmaetch PE-50
plasma-etch
Plasmaetch PE-50 Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks

Low power, high pressure plasma; low bias, minimal damage. Often used for surface treatment At SNF - nSiL lab

QSonica Q700 Sonicator
sonicator
Probe Sonicator Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks
Sinton Lifetime Tester
sinton-lifetime-tester
Sinton Lifetime Tester Training Flexible
SNF
SNF Exfab Paul G Allen 151 Ocean
Solidscape Wax 3D Printer
3d-wax-printer
Solidscape 3D Wax Printer Training Flexible
SNF
SNF Exfab Paul G Allen 151 Ocean
STS Plasma Enhanced CVD
sts
STS Plasma Enhanced CVD Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Thermco4
thermco4
Thermco Oxidation Furnaces Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Dry and wet oxidation. Use calculator to determine growth rate. N2 annealing available.

Thinky AR-100 Mixer
thinky-mixer
Thinky Mixer Training Flexible
SNF
SNF Exfab Paul G Allen 155 Mavericks
Ex Fab Develop Wet Bench
wbexfab_dev
WbExfab_Dev Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
Ex Fab Solvent Wet Bench
wbexfab_solv
WbExfab_Solv Training Flexible
SNF
SNF Exfab Paul G Allen 104 Stinson
Wet Bench Flexcorr 1
wbflexcorr-1
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.

Wet Bench Flexcorr 2
wbflexcorr-2
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. 3 hot pots available. GaAs allowed in personal labware only

Wet Bench Flexcorr 4
wbflexcorr-4
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. CTB. Labware for "clean" KOH or TMAH etching available. GaAs not allowed.

Wet Bench Flexcorr 3
wbflexcorr-3
Wet Bench Flexcorr 1and2 and 3and4 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual wet etching of non-standard materials. Hot Plate available. GaAs not allowed.

Wet Bench Flexible Solvents
wbflexsolv
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning of substrates or resist removal.

Wet Bench Flexible Solvents 1
wbflexsolv-1
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, two ultrasonic baths.

Wet Bench Flexible Solvents 2
wbflexsolv-2
Wet Bench Flexible Solvents 1 and 2 Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual solvent cleaning, hot plate

Wet Bench Miscellaneous
wbmiscres
Wet Bench Miscellaneous Photoresist Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Manual development of resist in beakers and Headway (manual resist spinner). SNF approved developers (acid or base). No solvents!

Wet Bench Resist Strip
wbresstrip-1
Wet Bench Resist Strip Clean (Ge), Semiclean, Flexible
SNF
SNF Cleanroom Paul G Allen L107

Wet Resist Removal: SRS-100 or PRS1000

ThermcoPoly2
thermcopoly2
Thermco Poly Deposition Furnace Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Standard polysilicon deposition at 620C. P and N doping available.

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Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Materials Lab Supplied Minimum Resolution Objective Separation Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
Matrix Plasma Resist Strip
matrix
Flexible
,
,
,
,
25
Micro Mist Coater PDR-04
micromist-coater
Flexible
Minitech-GX Micromill
micromill
Flexible
MRC Reactive Ion Etcher
mrc
Flexible
1
MVD
mvd
Flexible
1 Å - 50 nm
24 °C - 150 °C
Nanospec 3
nanospec3
Flexible
Optomec Printer
optomec-printer
Flexible
Oriel Deep UV Exposure Lamp
oriel-duv
Flexible
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
Oxford III-V etcher
Ox-35
Flexible
1
PDMS Hotplate
hotplate-1
Flexible
PDMS Spin Coater
spincoat-g3p8
Flexible
PDMS Workbench Flexible
PDS 2010 LABCOTER™ 2 Parylene Deposition System
parcoater
Flexible
,
,
,
,
,
,
,
,
,
,
,
,
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
1
Plasma Therm Versaline LL ICP Dielectric Etcher
PT-Ox
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Plasmaetch PE-50
plasma-etch
Flexible
Multiple
QSonica Q700 Sonicator
sonicator
Flexible
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer

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