Flexible

The "Flexible" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "Flexible" category.

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
Nanoscribe Photonics GT nanoscribe	Nanoscribe Photonics GT Training	Flexible	SNF Exfab Paul G Allen 104 Stinson
MVD mvd	MVD Training	Flexible	SNF Cleanroom Paul G Allen L107	Reactor located inside glovebox
MRC Reactive Ion Etcher mrc	MRC Reactive Ion Etcher Training	Flexible	SNF Cleanroom Paul G Allen L107	Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Minitech-GX Micromill micromill	Micromill Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Matrix Plasma Resist Strip matrix	Matrix Plasma Resist Strip Training	Flexible	SNF Cleanroom Paul G Allen L107	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Malvern Dynamic Light Scattering (DLS) Zetasizer Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Lesker Sputter lesker-sputter	Sputter Lesker 1&2 Training	Flexible	SNF Exfab Paul G Allen 155A Venice	reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Jasco UV-Vis-NIR jasco-uv-vis-nir	Jasco UV-Vis-NIR Training	Flexible	SNF Exfab Paul G Allen 151 Ocean
Ika T18 Disperser disperser	IKA Disperser Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Hummer V Sputter Coater hummer	Hummer V Sputter Coater Training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo
Glovebox-r glovebox-r	Glovebox-r Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Glovebox-l glovebox-l	Glovebox-l Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 4 fumehood4	Fumehood 4 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 3 fumehood3	Fumehood 3 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 2 fumehood2	Fumehood 2 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fumehood 1 fumehood1	Fumehood 1 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Ink Jet Printer Dimatix Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Formlabs Form2 3D Printer form2-3d-printer	3D Printer Form2 Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
Fisher Accuspin 24C centrifuge	Centrifuge Training	Flexible	SNF Exfab Paul G Allen 155 Mavericks
First Nano carbon nanotube CVD furnace cvd-nanotube	cvd-nanotube training	Flexible	SNF Exfab Paul G Allen L119 Año Nuevo	Aligned single-walled carbon nanotube growth with ST-cut quartz substrates (available from SNF stockroom);1-15 single-walled carbon nanotubes per micron density

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Equipment name & NEMO ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Materials Lab Supplied	Materials User Supplied	Process Temperature Range	Gases	Accessories Available	Substrate Size	Substrate Type	Maximum Load
Nanoscribe Photonics GT nanoscribe	3D Printing Patterning	Flexible											1
MVD mvd	Deposition > Atomic Layer Deposition (ALD) > Thermal ALD	Flexible			1.00 Å - 50.00 nm	C₉H₂₃NO₃Si Various Dielectrics Alumina DETA Hafnia ODS SAMS		24 °C - 150 °C	Ar		Pieces 2" 3" 4" 6" 8"
MRC Reactive Ion Etcher mrc	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Metals Various Dielectrics	Metal oxides PI					Ar CHClF₂ CHF₃ O₂ SF₆		Pieces 2" 3" 4" 6"		1
Minitech-GX Micromill micromill	Machining > Micromilling	Flexible
Matrix Plasma Resist Strip matrix	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Flexible	Resist	PI					O₂		4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	25
Malvern Dynamic Light Scattering (DLS) Zetasizer malvern-dls	Characterization > Dynamic Light Scattering	Flexible								Integrating Sphere	Pieces Other
Lesker Sputter lesker-sputter	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible				Ag Al AlSi Au Co Cr Cu Fe Nb Ni Pd Si SiO₂ Ta Ti TiN W Alumina ITO	CoFeB Ge Hf In₂O₃ LaB₆ Ru Sc Sn TiN WO₃ ZnO₃ ZrY GST Hafnia Moly Ti Tungsten				Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1 4 inch wafer, 1 6 inch wafer
Jasco UV-Vis-NIR jasco-uv-vis-nir	Characterization	Flexible
Ika T18 Disperser disperser	Sonication	Flexible
Hummer V Sputter Coater hummer	Deposition > Physical Vapor Deposition (PVD) > Sputtering	Flexible
Glovebox-r glovebox-r	Controlled Environment Material Transfer	Flexible				Various 2D Materials			N₂
Glovebox-l glovebox-l	Controlled Environment	Flexible
Fumehood 4 fumehood4	Controlled Environment	Flexible
Fumehood 3 fumehood3	Controlled Environment	Flexible
Fumehood 2 fumehood2	Controlled Environment	Flexible
Fumehood 1 fumehood1	Controlled Environment	Flexible
Fujifilm Dimatix Ink Jet Printer nanoinkjet	Deposition > Ink	Flexible				PROM Approval Required for Materials
Formlabs Form2 3D Printer form2-3d-printer	3D Printing	Flexible											Multiple parts - depending on the final part size
Fisher Accuspin 24C centrifuge	Centrifugation	Flexible
First Nano carbon nanotube CVD furnace cvd-nanotube	Deposition > Chemical Vapor Deposition (CVD) > Carbon Nanotube CVD Growth	Flexible				CNT		800 °C - 1100 °C	Ar C₂H₅OH CH₄ H₂ O₂		Pieces 2" 3" 4"	(Si) , (SiO2)	1x4" wafer or multiple pieces