The "Clean" cleanliness group is part of the SNF/ExFab contamination policy.
The following is a list of equipment that fall into the "Clean" category.
Equipment name & NEMO ID | Training Required & Charges | Cleanliness | Location | Notes |
---|---|---|---|---|
Wet Bench Clean 1 wbclean-1 |
Wet Bench Clean1and2 Training | Clean | SNF Cleanroom Paul G Allen L107 |
No resist allowed. Resist should have been removed at the wbclean_res-piranha. |
Tystar Bank 2 Tube 5 B2T5 Clean Oxide Anneal |
Tystar Atmospheric Tube Training | Clean | SNF Cleanroom Paul G Allen L107 | |
Tystar Bank 2 Tube 6 B2T6 Clean Oxide |
Tystar Atmospheric Tube Training | Clean | SNF Cleanroom Paul G Allen L107 | |
Tystar Bank 3 Tube 9 B3T9 Clean Oxide |
Tystar Atmospheric Tube Training | Clean | SNF Cleanroom Paul G Allen L107 |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Process Temperature Range | Chemicals | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|
Wet Bench Clean_res-piranha wbclean_res-piranha |
Clean |
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Wet Bench CMOS Metal wbclean3 |
Semiclean |
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25 wafers | |||||
Wet Bench Decontamination wbdecon |
Clean |
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Wet Bench Resist Strip wbresstrip-1 |
Clean (Ge), Semiclean, Flexible |
20 °C - 60 °C
|
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25 4 inch wafers |