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All

The "All" cleanliness group is part of the SNF/ExFab contamination policy.

The following is a list of equipment that fall into the "All" category.

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Equipment name & NEMO ID Training Required & Charges Cleanliness Locationsort descending Notes
Keyence Digital Microscope VHX-6000
keyence
Microscope Keyence Training All SNF Exfab Paul G Allen 104 Stinson
Nanospec 210XP
nanospec2
Nanospec Training All SNF Exfab Paul G Allen 104 Stinson

Manual Film Thickness Measurement. Single or dual layer transparent films > 300 Å

Headway 3 Manual Resist Spinner
headway3
Resist Coat (manual) Headway 3 Training All SNF Exfab Paul G Allen 104 Stinson
Heidelberg MLA 150
heidelberg
Heidelberg Training All SNF Exfab Paul G Allen 104 Stinson

Direct Write

HMDS Vapor Prime Oven, YES2
yes2
Exfab YES2 HMDS oven training All SNF Exfab Paul G Allen 104 Stinson

Singe and prime. No Resist allowed!

SEM -Zeiss Merlin
sem-merlin
SEM-Merlin Training All SNF Exfab Paul G Allen 104 Stinson
ASML PAS 5500/60 i-line Stepper
asml
Stepper ASML PAS 5500/60 i-line Training All SNF Cleanroom Paul G Allen L107

5:1 reducing stepper

PlasmaTherm Shuttlelock PECVD System
ccp-dep
PlasmaTherm Shuttlelock PECVD System Training All SNF Cleanroom Paul G Allen L107

To maintain cleanliness level, cleans of both the chamber and wafers are required prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) . Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

EVG Contact Aligner
evalign
Contact Aligner EVG Training All SNF Cleanroom Paul G Allen L107

1:1 Contact Aligner.
Anodic Bond, backside align, including IR.

PlasmaTherm Versaline HDP CVD System
hdpcvd
PlasmaTherm Versaline HDP CVD System Training All SNF Cleanroom Paul G Allen L107

To maintain cleanliness level there are cleans required for both the chamber and wafers prior to processing -

Substrates in clean category: Pre-Diffusion Clean

For semi-clean substrates: Standard Metal Clean (SRS100 + PRS1000) .  Run Chamber clean (no dummies) and conditioning with clean dummies prior to run

Mask Scrubber
masksrub
Mask Scrubber Training All SNF Cleanroom Paul G Allen L107

5 inch mask cleaning, water under pressure, no chemicals

Sensofar S-neox
s-neox
Sensofar S-neox Training All SNF Cleanroom Paul G Allen L107

non contact 3D optical profiling

Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

Prometrix Resistivity Mapping System
prometrix
Prometrix Training All SNF Cleanroom Paul G Allen L107

3 Probe Heads for different cleanliness groups.

SVG Develop Track 1
svgdev
SVG Resist Develop tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic development.

Flexus 2320 Stress Tester
stresstest
Stress Tester Flexus 2320 Training All SNF Cleanroom Paul G Allen L107
Laurell Manual Resist Spinner
laurell-R
Laurell Manual Resist Spinner Training All SNF Cleanroom Paul G Allen L107

SU-8, LOL, Ebeam resists allowed. No Acetone allowed. 

SVG Resist Coat Track 2
svgcoat2
SVG Resist Coat Tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic HMDS, Resist spinning, and Bake. AZ5214IR Image Reversal.

EVG 101 Spray Coater
evgspraycoat
Spray Coater EVG 101 Training All SNF Cleanroom Paul G Allen L107

Spray coating of resists

SVG Develop Track 2
svgdev2
SVG Resist Develop tracks 1 and 2 Training All SNF Cleanroom Paul G Allen L107

Automatic development.

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Equipment name & NEMO ID Technique Cleanliness Material Thickness Range Minimum Resolution Exposure Wavelength Mask Size Max Exposure Area Resist Developer Process Temperature Range Chemicals Sample Size Limits Resolution Notes Substrate Size Substrate Type Maximum Load
ASML PAS 5500/60 i-line Stepper
asml
All
365 nm 5 inch
,
,
,
,
EVG 101 Spray Coater
evgspraycoat
All ,
,
,
,
1
EVG Contact Aligner
evalign
All
350 - 450 nm 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch ,
,
,
,
one piece or wafer
Flexus 2320 Stress Tester
stresstest
All ,
,
,
,
,
,
,
,
1
Headway 3 Manual Resist Spinner
headway3
All 1 piece or wafer
Headway Manual Resist Spinner
headway2
All ,
,
,
,
,
,
,
,
,
one piece or wafer
Heidelberg MLA 150
heidelberg
All
405 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
Heidelberg MLA 150 - 2
heidelberg2
All
375 nm ,
,
,
,
,
,
,
,
,
,
,
,
1
HMDS Vapor Prime Oven, YES
yes
All
150 ºC
,
,
,
,
,
,
,
,
HMDS Vapor Prime Oven, YES2
yes2
All
150 ºC
25
Karl Suss MA-6 Contact Aligner
karlsuss
All
365 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
,
,
,
,
,
,
,
,
Karl Suss MA-6 Contact Aligner
karlsuss2
All
365 nm or 405 nm 4 inch, 5 inch, 7 inch 5 inch mask = 4 inch, 7 inch mask = 6 inch, 4 inch mask = 3 inch ,
,
,
,
,
,
,
,
,
Keyence Digital Microscope VHX-6000
keyence
All ,
,
,
,
,
,
,
,
Lakeshore Hall Measurement System
LakeshoreHall
All
100.00 μm - 1000.00 μm
-258 °C - 1000 °C
8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
1 piece
Laurell Manual Resist Spinner
laurell-R
All
LEI1500 Contactless Sheet Resistance Mapping
eddycurrent
All 8 in wafer

Sensor Transducer Size is 14 mm diameter 

,
,
,
,
,
,
,
,
,
,
,
1 wafer(2" to 8")
Mask Scrubber
masksrub
All 5 inch
micromanipulator6000 IV-CV probe station
micromanipulator6000
All ,
,
,
,
,
,
,
,
,
,
,
1x4" wafer
Nanospec 210XP
nanospec2
All ,
,
,
,
,
,
,
,
Nanospec 3
nanospec3
All

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