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Stanford Nanofabrication Facility
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SNF: Wafer Bonding, Sawing and Polishing
mr_equipment
Specifications
Items per page
5
10
20
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50
60
- All -
Equipment name & NEMO ID
Technique
Cleanliness
Substrate Size
Substrate Type
EVG Wafer Bonder
evbond
Bonding
Flexible
Pieces
2"
3"
4"
(Si)
,
(SiO2)
,
(Al
2
O
3
)
,
(SiO
2
)
,
(SiC)
,
(LiNb)
Summary
Items per page
5
10
20
40
50
60
- All -
Equipment name & NEMO ID
Training Required & Charges
Cleanliness
Location
Notes
EVG Wafer Bonder
evbond
Wafer Bonder EVG Training
Flexible
SNF Cleanroom Paul G Allen L107
Items per page
5
10
20
40
50
60
- All -
Equipment name & NEMO ID
Training Required & Charges
Cleanliness
Location
Notes
EVG Wafer Bonder
evbond
Wafer Bonder EVG Training
Flexible
SNF Cleanroom Paul G Allen L107
Items per page
5
10
20
40
50
60
- All -
Equipment name & NEMO ID
Technique
Cleanliness
Substrate Size
Substrate Type
EVG Wafer Bonder
evbond
Bonding
Flexible
Pieces
2"
3"
4"
(Si)
,
(SiO2)
,
(Al
2
O
3
)
,
(SiO
2
)
,
(SiC)
,
(LiNb)
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