Equipment name & NEMO ID | Training Required & Charges | Cleanliness | Location | Notes |
---|---|---|---|---|
AMAT P5000 Etcher p5000etch |
Dry Etcher AMAT P5000 Training | Clean, Clean (Ge), Semiclean | SNF Cleanroom Paul G Allen L107 | |
Gasonics Aura Asher gasonics |
Resist Removal Dry Gasonics Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps. |
Lam Research TCP 9400 Poly Etcher lampoly |
Lam Research TCP 9400 Poly Etcher Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides. |
Matrix Plasma Resist Strip matrix |
Matrix Plasma Resist Strip Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
MRC Reactive Ion Etcher mrc |
MRC Reactive Ion Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode |
Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
Oxford III-V etcher Ox-35 |
Oxford III-V etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Metal etching or Metal hard masks are not allowed. 4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only. |
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training | All | SNF Cleanroom Paul G Allen L107 |
Pieces need a carrier wafer; Isotropic Etching |
Xactix Xenon Difluoride Etcher xactix |
Xactix Xenon Difluoride Etcher Training | All | SNF Cleanroom Paul G Allen L107 |
Isotropic Si etching; can be used for backside Si removal on small pieces |
Technics Asher technics |
Technics Asher Training | Flexible | SNF Cleanroom Paul G Allen L107 | |
Samco PC300 Plasma Etch System samco |
Samco Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Equipment name & NEMO ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|
AMAT P5000 Etcher p5000etch |
Clean, Clean (Ge), Semiclean | ||||||||
Gasonics Aura Asher gasonics |
Clean, Semiclean | 25 | |||||||
Lam Research TCP 9400 Poly Etcher lampoly |
Clean, Semiclean |
, |
25 | ||||||
Matrix Plasma Resist Strip matrix |
Flexible |
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25 | ||||||
MRC Reactive Ion Etcher mrc |
Flexible | 1 | |||||||
Oxford Dielectric Etcher oxford-rie |
Flexible |
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1 | ||||||
Oxford III-V etcher Ox-35 |
Flexible | 1 | |||||||
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Flexible | 1 | |||||||
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Flexible | 1 | |||||||
Samco PC300 Plasma Etch System samco |
Flexible |
20 ÂșC
|
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Four 4" wafers or two 6" wafers and one 8" wafer | |||||
SPTS uetch vapor etch uetch |
All |
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1 | ||||||
Technics Asher technics |
Flexible |
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Four 4" wafers to pieces, one 6" or 8" wafer | ||||||
Xactix Xenon Difluoride Etcher xactix |
All |
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1 |