Equipment name & Badger ID | Training Required & Charges | Cleanliness | Lab Organization | Location | Notes |
---|---|---|---|---|---|
AMAT P5000 Etcher p5000etch |
AMAT P5000 Etcher Training | Clean, Clean (Ge), Semiclean | SNF Cleanroom Paul G Allen L107 | ||
Drytek 100 Plasma Etcher drytek2 |
Drytek 100 Plasma Etcher Training | All | SNF Cleanroom Paul G Allen L107 |
Batch processing tool; 6 stacked electrodes; no clamp; wafers and pieces can be loaded directly on the grounded electrode |
|
Gasonics Aura Asher gasonics |
Gasonics Aura Asher Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps. |
|
Lam Research TCP 9400 Poly Etcher lampoly |
Lam Research TCP 9400 Poly Etcher Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides. |
|
Matrix Plasma Resist Strip matrix |
Matrix Plasma Resist Strip Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating. |
|
MRC Reactive Ion Etcher mrc |
MRC Reactive Ion Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode |
|
Oxford Dielectric Etcher oxford-rie |
Oxford Dielectric Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers |
|
Oxford III-V etcher Ox-35 |
Oxford III-V etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only. |
|
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching |
|
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Plasma Therm Versaline LL ICP Metal Etcher Training | Flexible | SNF Cleanroom Paul G Allen L107 |
Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues) |
|
Samco PC300 Plasma Etch System samco |
Samco Training | Flexible | SNF Cleanroom Paul G Allen L107 | ||
SPTS uetch vapor etch uetch |
SPTS uetch vapor etch Training | All | SNF Cleanroom Paul G Allen L107 |
Pieces need a carrier wafer; Isotropic Etching |
|
STS Deep RIE Etcher stsetch |
STS Deep RIE Etcher Training | Clean, Semiclean | SNF Cleanroom Paul G Allen L107 |
4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching |
|
Technics Asher technics |
Technics Asher Training | Flexible | SNF Cleanroom Paul G Allen L107 | ||
Xactix Xenon Difluoride Etcher xactix |
Xactix Xenon Difluoride Etcher Training | All | SNF Cleanroom Paul G Allen L107 |
Isotropic Si etching; can be used for backside Si removal on small pieces |
Equipment name & Badger ID | Technique | Cleanliness | Primary Materials Etched | Other Materials Etched | Material Thickness Range | Minimum Resolution | Objective Separation | Process Temperature Range | Gases | Substrate Size | Substrate Type | Maximum Load |
---|---|---|---|---|---|---|---|---|---|---|---|---|
AMAT P5000 Etcher p5000etch |
Clean, Clean (Ge), Semiclean |
|
|
|
|
|||||||
Drytek 100 Plasma Etcher drytek2 |
All |
|
|
|
|
6 | ||||||
Gasonics Aura Asher gasonics |
Clean, Semiclean |
|
|
|
|
25 | ||||||
Lam Research TCP 9400 Poly Etcher lampoly |
Clean, Semiclean |
|
|
|
|
, |
25 | |||||
Matrix Plasma Resist Strip matrix |
Flexible |
|
|
|
|
, , , , |
25 | |||||
MRC Reactive Ion Etcher mrc |
Flexible |
|
|
|
|
1 | ||||||
Oxford Dielectric Etcher oxford-rie |
Flexible |
|
|
|
|
, , , , |
1 | |||||
Oxford III-V etcher Ox-35 |
Flexible |
|
|
|
|
1 | ||||||
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
Flexible |
|
|
|
|
1 | ||||||
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
Flexible |
|
|
|
|
1 | ||||||
Samco PC300 Plasma Etch System samco |
Flexible |
|
|
|
20 ºC
|
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Four 4" wafers or two 6" wafers and one 8" wafer | |||||
SPTS uetch vapor etch uetch |
All |
|
|
|
|
, , , , , , , , , |
1 | |||||
STS Deep RIE Etcher stsetch |
Clean, Semiclean |
|
|
|
|
1 | ||||||
Technics Asher technics |
Flexible |
|
|
|
|
, , |
Four 4" wafers to pieces, one 6" or 8" wafer | |||||
Xactix Xenon Difluoride Etcher xactix |
All |
|
|
|
|
, , , , , , , , , |
1 |
Equipment name & Badger ID | Location | Image | Overview | Primary Materials Etched | Link to Training |
---|---|---|---|---|---|
AMAT P5000 Etcher p5000etch |
SNF Cleanroom Paul G Allen L107 |
![]() |
P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process...Read more |
AMAT P5000 Etcher Training | |
Drytek 100 Plasma Etcher drytek2 |
SNF Cleanroom Paul G Allen L107 |
![]() |
The Drytek plasma etchers at SNF all use chlorine and fluorine-based chemistry for etching various...Read more |
Drytek 100 Plasma Etcher Training | |
Gasonics Aura Asher gasonics |
SNF Cleanroom Paul G Allen L107 |
![]() |
The Gasonics Aura Asher is an automated downstream microwave plasma system used for stripping photoresist...Read more |
Gasonics Aura Asher Training | |
Lam Research TCP 9400 Poly Etcher lampoly |
SNF Cleanroom Paul G Allen L107 |
![]() |
Lam 9400 TCP is a Polysilicon DryEtcher with Envision software; Clean category; for polysilicon and...Read more |
Lam Research TCP 9400 Poly Etcher Training | |
Matrix Plasma Resist Strip matrix |
SNF Cleanroom Paul G Allen L107 |
![]() |
The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination...Read more |
Matrix Plasma Resist Strip Training | |
MRC Reactive Ion Etcher mrc |
SNF Cleanroom Paul G Allen L107 |
![]() |
The MRC is a general purpose, plasma reactive ion etching system, used to etch a...Read more | MRC Reactive Ion Etcher Training | |
Oxford Dielectric Etcher oxford-rie |
SNF Cleanroom Paul G Allen L107 |
![]() |
Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and...Read more | Oxford Dielectric Etcher Training | |
Oxford III-V etcher Ox-35 |
SNF Cleanroom Paul G Allen L107 |
![]() |
The Oxford III-V Etcher (Ox-35) is an inductively-coupled plasma (ICP) reactive ion etcher (RIE), designed...Read more |
Oxford III-V etcher Training | |
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE |
SNF Cleanroom Paul G Allen L107 |
![]() |
PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Si etches using Bosch...Read more | Plasma Therm Versaline LL ICP Deep Silicon Etcher Training | |
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL |
SNF Cleanroom Paul G Allen L107 |
![]() |
The Versaline LL-ICP Metal Etcher was acquired in late 2011 for precision metal etching on...Read more |
Plasma Therm Versaline LL ICP Metal Etcher Training | |
Samco PC300 Plasma Etch System samco |
SNF Cleanroom Paul G Allen L107 |
![]() |
Samco Training | ||
SPTS uetch vapor etch uetch |
SNF Cleanroom Paul G Allen L107 |
![]() |
The SPTS uetch vapor system uses anhydrous HF and ethanol at reduced pressure and 45C...Read more | SPTS uetch vapor etch Training | |
STS Deep RIE Etcher stsetch |
SNF Cleanroom Paul G Allen L107 |
![]() |
This is a ICP (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems....Read more |
STS Deep RIE Etcher Training | |
Technics Asher technics |
SNF Cleanroom Paul G Allen L107 |
![]() |
Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma...Read more |
Technics Asher Training | |
Xactix Xenon Difluoride Etcher xactix |
SNF Cleanroom Paul G Allen L107 |
![]() |
The Xactix e-1 is a XeF2 (xenon difluoride) isotropic silicon etcher. XeF2 is a vapor...Read more |
Xactix Xenon Difluoride Etcher Training |