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SNF: Dry Etching

mr_equipment

Specifications

Equipment name & Badger ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Minimum Resolution	Objective Separation	Process Temperature Range	Gases	Substrate Size	Substrate Type	Maximum Load
AMAT P5000 Etcher p5000etch	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE) > Magnetically Enhanced RIE (MERIE)	Clean, Clean (Ge), Semiclean	Si based materials Si SiGe SiN SiO₂ SiON Poly Silicon	C C C dimethylpolysiloxane poly(p-xylylene) SiC Ti Various C-based W WSi₂ PI Resist Ti Tungsten					80% He/ 20%O₂ Ar CF₄ CHF₃ Cl₂ HBr He N₂ NF₃ O₂ SF₆
Gasonics Aura Asher gasonics	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Clean, Semiclean	Resist	PI					O₂	4"	(Si)	25
Lam Research TCP 9400 Poly Etcher lampoly	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Clean, Semiclean	Si Poly Silicon	Ge SiGe					80% He/ 20%O₂ C₂F₆ CF₄ Cl₂ HBr He N₂ O₂	4"	(Si) , (SiGe)	25
Matrix Plasma Resist Strip matrix	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Flexible	Resist	PI					O₂	4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	25
MRC Reactive Ion Etcher mrc	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Metals Various Dielectrics	Metal oxides PI					Ar CHClF₂ CHF₃ O₂ SF₆	Pieces 2" 3" 4" 6"		1
Oxford Dielectric Etcher oxford-rie	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	SiC SiN SiO₂ PI	C					Ar CF₄ CHF₃ N₂ O₂ SF₆	4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	1
Oxford III-V etcher Ox-35	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	GaAs	AlGaN AlInP GaN InGaP InSb					Ar BCl₃ CH₄ Cl₂ H₂ HBr N₂ O₂ SF₆	4"		1
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	Si						Ar C₄F₈ O₂ SF₆	4" 6"		1
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	Al Various Various	GaN					Ar BCl₃ CF₄ CH₄ Cl₂ N₂ O₂ SF₆	4" 6"		1
Samco PC300 Plasma Etch System samco	Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Plasma Mode Etching Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Resist	Si based materials dimethylpolysiloxane Si SiN SiO₂ SiON Various polymers PI Poly Silicon				20 ºC	CF₄ O₂ SF₆	Pieces 2" 3" 4" 6" 8" Other	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb) , (Various)	Four 4" wafers or two 6" wafers and one 8" wafer
SPTS uetch vapor etch uetch	Etching > Vapor Etching	All	SiO₂						C₂H₅OH HF vapor	Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1
STS Deep RIE Etcher stsetch	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Clean, Semiclean	Si	Ge SiGe					C₄F₈ O₂ SF₆	4"		1
Technics Asher technics	Etching > Dry Etching Cleaning > Resist Removal > Dry Resist Removal	Flexible	Resist	dimethylpolysiloxane poly(p-xylylene) PI					O₂	Pieces 4" 6" 8"	(Si) , (SiO2) , (SiO₂)	Four 4" wafers to pieces, one 6" or 8" wafer
Xactix Xenon Difluoride Etcher xactix	Etching > Vapor Etching	All	Ge Si SiGe						N₂ XeF₂	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1

Summary

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
AMAT P5000 Etcher p5000etch	AMAT P5000 Etcher Training	Clean, Clean (Ge), Semiclean	SNF	SNF Cleanroom Paul G Allen L107
Gasonics Aura Asher gasonics	Gasonics Aura Asher Training	Clean, Semiclean	SNF	SNF Cleanroom Paul G Allen L107	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.
Lam Research TCP 9400 Poly Etcher lampoly	Lam Research TCP 9400 Poly Etcher Training	Clean, Semiclean	SNF	SNF Cleanroom Paul G Allen L107	Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.
Matrix Plasma Resist Strip matrix	Matrix Plasma Resist Strip Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
MRC Reactive Ion Etcher mrc	MRC Reactive Ion Etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Oxford Dielectric Etcher oxford-rie	Oxford Dielectric Etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Oxford III-V etcher Ox-35	Oxford III-V etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE	Plasma Therm Versaline LL ICP Deep Silicon Etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Plasma Therm Versaline LL ICP Metal Etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)
Samco PC300 Plasma Etch System samco	Samco Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
SPTS uetch vapor etch uetch	SPTS uetch vapor etch Training	All	SNF	SNF Cleanroom Paul G Allen L107	Pieces need a carrier wafer; Isotropic Etching
STS Deep RIE Etcher stsetch	STS Deep RIE Etcher Training	Clean, Semiclean	SNF	SNF Cleanroom Paul G Allen L107	4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching
Technics Asher technics	Technics Asher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Xactix Xenon Difluoride Etcher xactix	Xactix Xenon Difluoride Etcher Training	All	SNF	SNF Cleanroom Paul G Allen L107	Isotropic Si etching; can be used for backside Si removal on small pieces

Equipment name & Badger ID	Training Required & Charges	Cleanliness	Lab Organization	Location	Notes
AMAT P5000 Etcher p5000etch	AMAT P5000 Etcher Training	Clean, Clean (Ge), Semiclean	SNF	SNF Cleanroom Paul G Allen L107
Gasonics Aura Asher gasonics	Gasonics Aura Asher Training	Clean, Semiclean	SNF	SNF Cleanroom Paul G Allen L107	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.
Lam Research TCP 9400 Poly Etcher lampoly	Lam Research TCP 9400 Poly Etcher Training	Clean, Semiclean	SNF	SNF Cleanroom Paul G Allen L107	Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.
Matrix Plasma Resist Strip matrix	Matrix Plasma Resist Strip Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.
MRC Reactive Ion Etcher mrc	MRC Reactive Ion Etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode
Oxford Dielectric Etcher oxford-rie	Oxford Dielectric Etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers
Oxford III-V etcher Ox-35	Oxford III-V etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE	Plasma Therm Versaline LL ICP Deep Silicon Etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Plasma Therm Versaline LL ICP Metal Etcher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107	Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)
Samco PC300 Plasma Etch System samco	Samco Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
SPTS uetch vapor etch uetch	SPTS uetch vapor etch Training	All	SNF	SNF Cleanroom Paul G Allen L107	Pieces need a carrier wafer; Isotropic Etching
STS Deep RIE Etcher stsetch	STS Deep RIE Etcher Training	Clean, Semiclean	SNF	SNF Cleanroom Paul G Allen L107	4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching
Technics Asher technics	Technics Asher Training	Flexible	SNF	SNF Cleanroom Paul G Allen L107
Xactix Xenon Difluoride Etcher xactix	Xactix Xenon Difluoride Etcher Training	All	SNF	SNF Cleanroom Paul G Allen L107	Isotropic Si etching; can be used for backside Si removal on small pieces

Equipment name & Badger ID	Technique	Cleanliness	Primary Materials Etched	Other Materials Etched	Material Thickness Range	Minimum Resolution	Objective Separation	Process Temperature Range	Gases	Substrate Size	Substrate Type	Maximum Load
AMAT P5000 Etcher p5000etch	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE) > Magnetically Enhanced RIE (MERIE)	Clean, Clean (Ge), Semiclean	Si based materials Si SiGe SiN SiO₂ SiON Poly Silicon	C C C dimethylpolysiloxane poly(p-xylylene) SiC Ti Various C-based W WSi₂ PI Resist Ti Tungsten					80% He/ 20%O₂ Ar CF₄ CHF₃ Cl₂ HBr He N₂ NF₃ O₂ SF₆
Gasonics Aura Asher gasonics	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Clean, Semiclean	Resist	PI					O₂	4"	(Si)	25
Lam Research TCP 9400 Poly Etcher lampoly	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Clean, Semiclean	Si Poly Silicon	Ge SiGe					80% He/ 20%O₂ C₂F₆ CF₄ Cl₂ HBr He N₂ O₂	4"	(Si) , (SiGe)	25
Matrix Plasma Resist Strip matrix	Etching > Dry Etching > Downstream/Remote Plasma Etching Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal	Flexible	Resist	PI					O₂	4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	25
MRC Reactive Ion Etcher mrc	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Metals Various Dielectrics	Metal oxides PI					Ar CHClF₂ CHF₃ O₂ SF₆	Pieces 2" 3" 4" 6"		1
Oxford Dielectric Etcher oxford-rie	Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	SiC SiN SiO₂ PI	C					Ar CF₄ CHF₃ N₂ O₂ SF₆	4"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂)	1
Oxford III-V etcher Ox-35	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	GaAs	AlGaN AlInP GaN InGaP InSb					Ar BCl₃ CH₄ Cl₂ H₂ HBr N₂ O₂ SF₆	4"		1
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	Si						Ar C₄F₈ O₂ SF₆	4" 6"		1
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Flexible	Al Various Various	GaN					Ar BCl₃ CF₄ CH₄ Cl₂ N₂ O₂ SF₆	4" 6"		1
Samco PC300 Plasma Etch System samco	Cleaning > Resist Removal > Dry Resist Removal > Downstream/Remote Plasma Resist Removal Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Plasma Mode Etching Etching > Dry Etching > Capacitively Coupled Plasma Etching (CCP) > Reactive Ion Etching (RIE)	Flexible	Resist	Si based materials dimethylpolysiloxane Si SiN SiO₂ SiON Various polymers PI Poly Silicon				20 ºC	CF₄ O₂ SF₆	Pieces 2" 3" 4" 6" 8" Other	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs) , (Various) , (Various) , (LiNb) , (Various)	Four 4" wafers or two 6" wafers and one 8" wafer
SPTS uetch vapor etch uetch	Etching > Vapor Etching	All	SiO₂						C₂H₅OH HF vapor	Pieces 2" 3" 4" 6" 8"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1
STS Deep RIE Etcher stsetch	Etching > Dry Etching > Inductively Coupled Plasma Etching (ICP)	Clean, Semiclean	Si	Ge SiGe					C₄F₈ O₂ SF₆	4"		1
Technics Asher technics	Etching > Dry Etching Cleaning > Resist Removal > Dry Resist Removal	Flexible	Resist	dimethylpolysiloxane poly(p-xylylene) PI					O₂	Pieces 4" 6" 8"	(Si) , (SiO2) , (SiO₂)	Four 4" wafers to pieces, one 6" or 8" wafer
Xactix Xenon Difluoride Etcher xactix	Etching > Vapor Etching	All	Ge Si SiGe						N₂ XeF₂	Pieces 2" 3" 4" 6"	(Si) , (SiGe) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1

Equipment name & Badger ID	Location	Image	Overview	Primary Materials Etched	Link to Training
AMAT P5000 Etcher p5000etch	SNF Cleanroom Paul G Allen L107		P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process...Read more	Si based materials Si SiGe SiN SiO₂ SiON Poly Silicon	AMAT P5000 Etcher Training
Gasonics Aura Asher gasonics	SNF Cleanroom Paul G Allen L107		The Gasonics Aura Asher is an automated downstream microwave plasma system used for stripping photoresist...Read more	Resist	Gasonics Aura Asher Training
Lam Research TCP 9400 Poly Etcher lampoly	SNF Cleanroom Paul G Allen L107		Lam 9400 TCP is a Polysilicon DryEtcher with Envision software; Clean category; for polysilicon and...Read more	Si Poly Silicon	Lam Research TCP 9400 Poly Etcher Training
Matrix Plasma Resist Strip matrix	SNF Cleanroom Paul G Allen L107		The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination...Read more	Resist	Matrix Plasma Resist Strip Training
MRC Reactive Ion Etcher mrc	SNF Cleanroom Paul G Allen L107		The MRC is a general purpose, plasma reactive ion etching system, used to etch a...Read more	Metals Various Dielectrics	MRC Reactive Ion Etcher Training
Oxford Dielectric Etcher oxford-rie	SNF Cleanroom Paul G Allen L107		Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and...Read more	SiC SiN SiO₂ PI	Oxford Dielectric Etcher Training
Oxford III-V etcher Ox-35	SNF Cleanroom Paul G Allen L107		The Oxford III-V Etcher (Ox-35) is an inductively-coupled plasma (ICP) reactive ion etcher (RIE), designed...Read more	GaAs	Oxford III-V etcher Training
Plasma Therm Versaline LL ICP Deep Silicon Etcher PT-DSE	SNF Cleanroom Paul G Allen L107		PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Si etches using Bosch...Read more	Si	Plasma Therm Versaline LL ICP Deep Silicon Etcher Training
Plasma Therm Versaline LL ICP Metal Etcher PT-MTL	SNF Cleanroom Paul G Allen L107		The Versaline LL-ICP Metal Etcher was acquired in late 2011 for precision metal etching on...Read more	Al Various Various	Plasma Therm Versaline LL ICP Metal Etcher Training
Samco PC300 Plasma Etch System samco	SNF Cleanroom Paul G Allen L107			Resist	Samco Training
SPTS uetch vapor etch uetch	SNF Cleanroom Paul G Allen L107		The SPTS uetch vapor system uses anhydrous HF and ethanol at reduced pressure and 45C...Read more	SiO₂	SPTS uetch vapor etch Training
STS Deep RIE Etcher stsetch	SNF Cleanroom Paul G Allen L107		This is a ICP (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems....Read more	Si	STS Deep RIE Etcher Training
Technics Asher technics	SNF Cleanroom Paul G Allen L107		Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma...Read more	Resist	Technics Asher Training
Xactix Xenon Difluoride Etcher xactix	SNF Cleanroom Paul G Allen L107		The Xactix e-1 is a XeF2 (xenon difluoride) isotropic silicon etcher. XeF2 is a vapor...Read more	Ge Si SiGe	Xactix Xenon Difluoride Etcher Training