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SNF: Dry Etching

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Equipment name & Badger ID Training Required & Charges Cleanliness Lab Organization Location Notes
AMAT P5000 Etcher
p5000etch
AMAT P5000 Etcher Training Clean, Clean (Ge), Semiclean
SNF
SNF Cleanroom Paul G Allen L107
Gasonics Aura Asher
gasonics
Gasonics Aura Asher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Wafers heated by lamps.

Lam Research TCP 9400 Poly Etcher
lampoly
Lam Research TCP 9400 Poly Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

Single wafer etch with auto-loading from a cassette. Equipment originally used for gate etching with high selectivity to thin gate oxides.

Matrix Plasma Resist Strip
matrix
Matrix Plasma Resist Strip Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer tool with auto loading from a cassette. Pieces need a pocket carrier wafer for transport. Chuck temperature controls wafer heating.

MRC Reactive Ion Etcher
mrc
MRC Reactive Ion Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Typically used for sputter etching; Single wafer, direct load system; wafers/ pieces can be directly placed on electrode

Oxford Dielectric Etcher
oxford-rie
Oxford Dielectric Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers

Oxford III-V etcher
Ox-35
Oxford III-V etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; can be adopted to do 6" or 8" wafers; pieces need to be bonded to carrier wafers; Restrictions: III-V materials only.

Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Bosch process for Si etching; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; need a support wafer for through wafer etching, can be used for Isotropic Si Etching

Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Plasma Therm Versaline LL ICP Metal Etcher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107

Single wafer; Default 4" config; Can be converted to 6" config; pieces need to be attached to carrier wafer; Restrictions: Can not etch metals or metal oxides with no volatile by-products (shorting & arcing issues)

Samco PC300 Plasma Etch System
samco
Samco Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
SPTS uetch vapor etch
uetch
SPTS uetch vapor etch Training All
SNF
SNF Cleanroom Paul G Allen L107

Pieces need a carrier wafer; Isotropic Etching

STS Deep RIE Etcher
stsetch
STS Deep RIE Etcher Training Clean, Semiclean
SNF
SNF Cleanroom Paul G Allen L107

4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching

Technics Asher
technics
Technics Asher Training Flexible
SNF
SNF Cleanroom Paul G Allen L107
Xactix Xenon Difluoride Etcher
xactix
Xactix Xenon Difluoride Etcher Training All
SNF
SNF Cleanroom Paul G Allen L107

Isotropic Si etching; can be used for backside Si removal on small pieces

Equipment name & Badger ID Technique Cleanliness Primary Materials Etched Other Materials Etched Material Thickness Range Minimum Resolution Objective Separation Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
AMAT P5000 Etcher
p5000etch
Clean, Clean (Ge), Semiclean
Gasonics Aura Asher
gasonics
Clean, Semiclean
25
Lam Research TCP 9400 Poly Etcher
lampoly
Clean, Semiclean
,
25
Matrix Plasma Resist Strip
matrix
Flexible
,
,
,
,
25
MRC Reactive Ion Etcher
mrc
Flexible
1
Oxford Dielectric Etcher
oxford-rie
Flexible
,
,
,
,
1
Oxford III-V etcher
Ox-35
Flexible
1
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
Flexible
1
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
Flexible
1
Samco PC300 Plasma Etch System
samco
Flexible
20 ºC
,
,
,
,
,
,
,
,
,
,
,
,
,
Four 4" wafers or two 6" wafers and one 8" wafer
SPTS uetch vapor etch
uetch
All
,
,
,
,
,
,
,
,
,
1
STS Deep RIE Etcher
stsetch
Clean, Semiclean
1
Technics Asher
technics
Flexible
,
,
Four 4" wafers to pieces, one 6" or 8" wafer
Xactix Xenon Difluoride Etcher
xactix
All
,
,
,
,
,
,
,
,
,
1
Equipment name & Badger ID Location Image Overview Primary Materials Etched Link to Training
AMAT P5000 Etcher
p5000etch
SNF Cleanroom Paul G Allen L107

P5000 is a load-locked, magnetically enhanced reactive ion etching system (MERIE) with two functional process...Read more

AMAT P5000 Etcher Training
Gasonics Aura Asher
gasonics
SNF Cleanroom Paul G Allen L107

The Gasonics Aura Asher is an automated downstream microwave plasma system used for stripping photoresist...Read more

Gasonics Aura Asher Training
Lam Research TCP 9400 Poly Etcher
lampoly
SNF Cleanroom Paul G Allen L107
photo of lampoly etcher in SNF cleanroom

Lam 9400 TCP is a Polysilicon DryEtcher with Envision software; Clean category; for polysilicon and...Read more

Lam Research TCP 9400 Poly Etcher Training
Matrix Plasma Resist Strip
matrix
SNF Cleanroom Paul G Allen L107
photo of matrix in SNF cleanroom

The Matrix plasma asher is used to strip photoresist from contaminated wafers using a combination...Read more

Matrix Plasma Resist Strip Training
MRC Reactive Ion Etcher
mrc
SNF Cleanroom Paul G Allen L107
photo of mrc etcher in SNF cleanroom
The MRC is a general purpose, plasma reactive ion etching system, used to etch a...Read more MRC Reactive Ion Etcher Training
Oxford Dielectric Etcher
oxford-rie
SNF Cleanroom Paul G Allen L107
photo of oxrie etcher in SNF Cleanroom
Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and...Read more Oxford Dielectric Etcher Training
Oxford III-V etcher
Ox-35
SNF Cleanroom Paul G Allen L107
photo of ox35 in SNF Cleanroom

The Oxford III-V Etcher (Ox-35) is an inductively-coupled plasma (ICP) reactive ion etcher (RIE), designed...Read more

Oxford III-V etcher Training
Plasma Therm Versaline LL ICP Deep Silicon Etcher
PT-DSE
SNF Cleanroom Paul G Allen L107
photo of PT-DSE in SNF Cleanroom
PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Si etches using Bosch...Read more
Plasma Therm Versaline LL ICP Deep Silicon Etcher Training
Plasma Therm Versaline LL ICP Metal Etcher
PT-MTL
SNF Cleanroom Paul G Allen L107
photo of ptmtl in SNF Cleanroom

The Versaline LL-ICP Metal Etcher was acquired in late 2011 for precision metal etching on...Read more

Plasma Therm Versaline LL ICP Metal Etcher Training
Samco PC300 Plasma Etch System
samco
SNF Cleanroom Paul G Allen L107
Samco Training
SPTS uetch vapor etch
uetch
SNF Cleanroom Paul G Allen L107
photo of uetch in SNF Cleanroom
The SPTS uetch vapor system uses anhydrous HF and ethanol at reduced pressure and 45C...Read more SPTS uetch vapor etch Training
STS Deep RIE Etcher
stsetch
SNF Cleanroom Paul G Allen L107
photo of stsetch in SNF Cleanroom

This is a ICP (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems....Read more

STS Deep RIE Etcher Training
Technics Asher
technics
SNF Cleanroom Paul G Allen L107

Technics PE II-A is used for descum, resist strip and surface treatment with O2 plasma...Read more

Technics Asher Training
Xactix Xenon Difluoride Etcher
xactix
SNF Cleanroom Paul G Allen L107

The Xactix e-1 is a XeF2 (xenon difluoride) isotropic silicon etcher.  XeF2 is a vapor...Read more

Xactix Xenon Difluoride Etcher Training