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SNF: Annealing, Oxidation and Doping

mr_equipment

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Equipment name & NEMO ID Technique Cleaning Required Cleanliness Material Thickness Range Materials Lab Supplied Process Temperature Range Gases Substrate Size Substrate Type Maximum Load
RTA AllWin 610
aw610_l
Pre-Diffusion Clean Clean
21 °C - 1150 °C
,
,
1 wafer
RTA AllWin 610
aw610_r
Flexible
21 °C - 1150 °C
,
,
Thermco3 Oxidation Furnace
thermco 3
Pre-Diffusion Clean Clean
25.00 Å - 2.00 μm
700 °C - 1100 °C
50
Tylan9 Forming Gas Anneal Furnace
tylan9
Flexible
250 °C - 1100 °C
,
,
50