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nSiL: 159 Capitola

New Badger Area created for occupancy limits.

mr_equipment

Specifications

Equipment name & NEMO ID	Technique	Cleanliness	Substrate Size	Substrate Type	Maximum Load
CMP GnP POLI-400L cmp	Machining > Wafer Polishing	Flexible
DISCO Backgrinder disco-backgrind	Machining	Flexible
DISCO Wafer Saw DISCO wafersaw	Machining > Wafer Saw	Flexible	Pieces 2" 3" 4" 6" 8"	(Si) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1x4", 1x6" or 1x8" wafer, or pieces

Summary

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
CMP GnP POLI-400L cmp	CMP POLI-400L Training	Flexible	SNF Exfab Paul G Allen 159 Capitola
DISCO Backgrinder disco-backgrind	Backgrinder DISCO Training	Flexible	SNF Exfab Paul G Allen 159 Capitola
DISCO Wafer Saw DISCO wafersaw	Wafersaw DISCO training	Flexible	SNF Exfab Paul G Allen 159 Capitola

Equipment name & NEMO ID	Training Required & Charges	Cleanliness	Location	Notes
CMP GnP POLI-400L cmp	CMP POLI-400L Training	Flexible	SNF Exfab Paul G Allen 159 Capitola
DISCO Backgrinder disco-backgrind	Backgrinder DISCO Training	Flexible	SNF Exfab Paul G Allen 159 Capitola
DISCO Wafer Saw DISCO wafersaw	Wafersaw DISCO training	Flexible	SNF Exfab Paul G Allen 159 Capitola

Equipment name & NEMO ID	Technique	Cleanliness	Substrate Size	Substrate Type	Maximum Load
CMP GnP POLI-400L cmp	Machining > Wafer Polishing	Flexible
DISCO Backgrinder disco-backgrind	Machining	Flexible
DISCO Wafer Saw DISCO wafersaw	Machining > Wafer Saw	Flexible	Pieces 2" 3" 4" 6" 8"	(Si) , (SiO2) , (Al₂O₃) , (SiO₂) , (Ge) , (SiC) , (GaN) , (III-V) , (GaAs)	1x4", 1x6" or 1x8" wafer, or pieces