Lesker is a load locked single wafer metal sputter providing flexible processing options for non-CMOS compatible materials. The eight gun magnetron Lesker is classified as gold contaminated and provides non-directional thin film (< 1 um)
Cleanliness:
Flexible
Lab Facility:
Mavericks (Room 155)
Training Charges:
1.00 hours
Primary Trainer:
Maurice Stevens
Primary Maintenance:
Saeed Nejad
Backup Maintenance:
Graham Ewing
Steps to become a tool user
- Read the relevant operating procedures:
- Lesker Operation Manual
- Shadowing: **ALL SHADOWING MUST BE APPROVED BY SNF STAFF BEFORE SHADOWING SESSION AS PART OF NEW NORMAL POLICIES** Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Print the SNF Training Shadowing Form on clean room paper. - Contact the primary trainer:.Maurice Stevens
Location:
SNF Exfab Paul G Allen 155A Venice
Badger Area:
nSiL: 155A Venice
Badger ID:
lesker-sputter
Pieces
2 inch wafer
3 inch wafer
4 inch wafer
6 inch wafer
Maximum Load:
1 4 inch wafer, 1 6 inch wafer
Cobalt Iron Boron (CoFeB)
Germanium (Ge)
GST (GeSbTe)
Hafnium (Hf)
Hafnia (HfO2)
Indium Oxide (In2O3)
Lanthanum hexaboride (LaB6)
Moly (Mo)
Ruthenium (Ru)
Scandium (Sc)
Tin (Sn)
Titanium NItride (TiN)
Ti Tungsten (TiW)
Tungsten Oxide (WO3)
Zinc Oxide (ZnO3)
Zirconium Yittrium Alloy (ZrY)
Notes:
reactive O2/N2 sputtering, substrate bias, substrate heating, co-sputter
Aluminum (Al)
Alumina (Al2O3)
Aluminum Silicon (AlSi)
Chromium (Cr)
Cobalt (Co)
Copper (Cu)
Gold (Au)
ITO (InxSnyOz)
Iron (Fe)
Nickel (Ni)
Niobium (Nb)
Palladium (Pd)
Silicon (Si)
Silicon Dioxide (SiO2)
Silver (Ag)
Tantalum (Ta)
Titanium (Ti)
Titanium NItride (TiN)
Tungsten (W)
Silicon
Silicon Germanium
Quartz
Sapphire
Glass
Germanium
Silicon Carbide
Gallium Nitride
III-V
Gallium Arsenide