FINEPLACER® lambda is a flexible sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, universities, prototyping and low-volume production.The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.
Links
[1] https://snfguide.stanford.edu/snf/cleanliness/flexible
[2] https://snfguide.stanford.edu/guide/lab-organization-facility/snf
[3] https://snfguide.stanford.edu/guide/people/swaroop-kommera
[4] https://snfguide.stanford.edu/guide/people/elmer-enriquez
[5] https://snfguide.stanford.edu/forwards-to-snf-was-how-to-join-snf
[6] https://snfguide.stanford.edu/guide/locations/snf-exfab-paul-g-allen-104-stinson
[7] https://snfguide.stanford.edu/snf/badger-area/nsil-l104-stinson
[8] https://snfguide.stanford.edu/snf/substrate-size/pieces
[9] https://snfguide.stanford.edu/guide/substrate-size/4-inch-wafer
[10] https://snfguide.stanford.edu/guide/substrate-type/silicon
[11] https://snfguide.stanford.edu/guide/substrate-type/silicon-germanium
[12] https://snfguide.stanford.edu/guide/substrate-type/quartz
[13] https://snfguide.stanford.edu/guide/substrate-type/sapphire
[14] https://snfguide.stanford.edu/guide/substrate-type/glass
[15] https://snfguide.stanford.edu/guide/substrate-type/germanium