This is a ICP (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems. The platform is single-chamber, manual loadlock system. The etch process is based on the patented Laermer and Schlip process, commonly referred to as the Bosch Process. The etch process alternates between the passivating C4F8 plasma and the silicon etching SF6 plasma.
Cleanliness:
Clean
Semiclean
Lab Facility:
SNF Cleanroom
Training Charges:
1.00 hours
Primary Trainer:
Lavendra Mandyam
Backup Trainer(s):
Cliff Knollenberg
Primary Maintenance:
Elmer Enriquez
Backup Maintenance:
Mike Dickey
Steps to become a tool user
-
Become a member of SNF.
- Check the training calendar to for any scheduled training:.SNF Training Calendar
- Contact the primary trainer,, to sign-up for the training.Lavendra Mandyam
- Read the relevant operating procedures before the training session:
- STS Etch Operating Instructions
- Optional: For background on "Plasma Etching" and "Choosing an Etcher", Online training required. Open Online Course for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login to log in directly to the course. to log in directly to the course. Go to "nano@stanford" and then to the "Dry Etching" Section for the three videos on plasma etching principles and go to the "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment. - Attend the training session to be qualified.
Location:
SNF Cleanroom Paul G Allen L107
Badger Area:
SNF: Dry Etching
Badger ID:
stsetch
4 inch wafer
(O2)
(C4F8)
(SF6)
Maximum Load:
1
Notes:
4" wafers; pieces should be attached to the carrier wafer for etching; need to use the holder assembly for through wafer etching
Primary Materials Etched:
(Si)
Other Materials Etched:
Germanium
Silicon Germanium