The Drytek plasma etchers at SNF all use chlorine and fluorine-based chemistry for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films. Drytek4 (contaminated) also has additional capabilities for oxide etching and argon sputter etching.
Cleanliness:
All
Lab Facility:
SNF Cleanroom
Training Charges:
1.00 hours
Primary Trainer:
Mary Tang
Primary Maintenance:
Elmer Enriquez
Backup Maintenance:
Mike Dickey
Steps to become a tool user
-
Become a member of SNF.
- Check the training calendar for any scheduled training:.SNF Training Calendar
- Contact the primary trainer,, to sign up for the training or to schedule a training if none is scheduled.Mary Tang
- Read the relevant operating procedures:
- Drytek2 Model 100 Operating Instructions
- Online training optonal. See Online training required. Open Online Course for general information about the online training. for general information about the Lagunita online training.
Go to Go to Online Nano Course Login to log in directly to the course. to log in directly to the course. Go to "nano@stanford" and then to the "Dry Etching" section for the three videos on plasma etching principles and to "Choosing a Dry Etching Process" section for guidelines for choosing the right equipment. - You can also shadow and experienced user and submit the completed shadowing form to get qualified.
- Get qualified by either attending the training or submitting the shadowing form.
Location:
SNF Cleanroom Paul G Allen L107
Badger Area:
SNF: Dry Etching
Badger ID:
drytek2
Pieces
2 inch wafer
3 inch wafer
4 inch wafer
6 inch wafer
(CHClF2)
(O2)
(SF6)
(CF4)
Maximum Load:
6
Notes:
Batch processing tool; 6 stacked electrodes; no clamp; wafers and pieces can be loaded directly on the grounded electrode
Primary Materials Etched:
()
(Si)
(Si)
(SiN)
Other Materials Etched:
Carbon
Polyimide
Silicon Dioxide