About PPE: alcohol wipe down before and after each use. In addition, face shields will be placed in the steamer for 1 1/2 hours. Aprons will be user owned, not shared.
The Wet Bench Flexcorr1, part of the Wet Bench 1and2, is a manual wet chemical station used for etching or cleaning of SNF approved substrates or materials using only SNF approved acids or bases. GaAs processing is allowed but only in user provided labware. Solvents are not allowed!
Cleanliness:
Flexible
Lab Facility:
SNF Cleanroom
Training Charges:
2.25 hours
Primary Trainer:
Uli Thumser
Backup Trainer(s):
Mary Tang
Primary Maintenance:
Jim Haydon
Backup Maintenance:
Gary Sosa
Steps to become a tool user
-
Become a member of SNF.
- Read the relevant operating procedures:
- Wet Bench Flexcorr 1
- Wet Bench Flexcorr 3
- View the Plastic Tweezers Cleaning (9 minutes) movie.
- Shadowing: Contact a qualified user of the tool to arrange to ‘shadow’. It would be best to find someone who has used the system often. If you don’t know of anyone, you may check reservations or history to find a qualified user. You may also contact the Discussion Lists. We recommend that you be with the lab member for the full time while operating the tool and ask lots of questions during the shadowing. You may have to shadow a qualified user more than one time to be comfortable with the tool.
Please follow the instructions on this form: SNF Training Shadowing Form - "All Litho" class is required before training on any of the lithography tools. Please send an email to all-litho-training@lists.stanford.edu to sign up for the All Litho class. Read more here: All Litho class.
- Contact the primary trainer:.Uli Thumser
Location:
SNF Cleanroom Paul G Allen L107
Badger Area:
SNF: Wet Benches
Badger ID:
wbflexcorr-1
Pieces
2 inch wafer
3 inch wafer
4 inch wafer
6 inch wafer
Notes:
Manual wet etching of non-standard materials. Hot plate available. GaAs allowed in personal labware only.
Silicon
Silicon Germanium
Quartz
Sapphire
Glass
Germanium
Silicon Carbide
Gallium Nitride
III-V
Gallium Arsenide
Polymer
Primary Materials Etched:
(Al)
(Cr)
(Au)
()
(Si)
(SiO2)
(SiO)
Acids
20:1 Buffered oxide etch
6:1 Buffered oxide etch
85% Phosphoric Acid
9:1 Piranha Solution
50:1 Hydrofluoric Acid
Standard Clean 1
Standard Clean 2
Aluminum Etchant
Chromium Etchant
Gold Etchant
Bases
Potassium Hydroxide 45%